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Heat dissipation assembly and lamp with the heat dissipation assembly

A heat dissipation component and heat dissipation body technology, which is applied in semiconductor devices of light-emitting elements, lighting and heating equipment, and components of lighting devices, etc., can solve the problems of poor heat dissipation and occupied space, and achieve low cost, small occupied space, The effect of large heat dissipation area

Active Publication Date: 2022-07-12
SHENZHEN WANJINGHUA TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a heat dissipation assembly, aiming to solve the technical problems of the existing heat dissipation assembly taking up space and poor heat dissipation effect

Method used

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  • Heat dissipation assembly and lamp with the heat dissipation assembly
  • Heat dissipation assembly and lamp with the heat dissipation assembly
  • Heat dissipation assembly and lamp with the heat dissipation assembly

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Embodiment Construction

[0031] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0032] see Figure 1 to Figure 3 , the heat dissipation assembly provided by the first embodiment of the present invention includes a heat transfer plate 10, at least two heat dissipation bodies 20 installed on one side of the heat transfer plate 10, and two adjacent heat dissipation bodies 20 that are clamped The support member 30 between the heat sinks 20 includes a plurality of first heat sinks 21 arranged in layers, and two adjacent first heat sinks 21 on each of the heat sinks 20 are spaced apart and the two first heat sinks 21 are separated from each other. A heat dissipation space ...

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Abstract

The invention belongs to the field of heat dissipation structures, and in particular relates to a heat dissipation assembly and a lamp with the heat dissipation assembly, and aims to solve the technical problems that the existing heat dissipation assembly occupies relatively space and has poor heat dissipation effect. The first radiating fins arranged at intervals are stacked to form a radiating body, at least two radiating bodies are mounted on the heat transfer plate, and two adjacent radiating bodies are clamped on the support member, which is compact and firm. The heat generated by the light emitting module is first transferred to the heat transfer plate, and then transferred to the stacked first heat sinks. The two adjacent first heat sinks are spaced apart to form a heat dissipation space to enhance air convection, so that the heat can be quickly taken away by the airflow. The structure has a large heat dissipation area and uses a plurality of heat sinks to form a module combination, which achieves low cost and high efficiency and takes up less space.

Description

technical field [0001] The invention belongs to the field of heat dissipation structures, and in particular relates to a heat dissipation assembly and a lamp with the heat dissipation assembly. Background technique [0002] High-power LED lamps need to use heat dissipation components for heat dissipation. The heat dissipation components in the prior art usually adopt the structure of an integrally formed heat transfer plate and a heat dissipation fin, which takes up space and has poor heat dissipation effect. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to provide a heat dissipation assembly, which aims to solve the technical problems that the existing heat dissipation assembly occupies relatively space and has a poor heat dissipation effect. [0004] The present invention is realized in this way, a heat dissipation assembly includes a heat transfer plate, at least two heat dissipation bodies installed on one side of the heat transfer plate, an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V29/71F21V29/77F21V17/10F21Y115/10
Inventor 李俊宇
Owner SHENZHEN WANJINGHUA TECH
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