Unlock instant, AI-driven research and patent intelligence for your innovation.

PCB board and mobile terminal with it

A PCB board and board body technology, applied in the field of mobile terminals, can solve problems such as stress damage of bare chip chips, and achieve the effect of prolonging service life

Active Publication Date: 2018-06-29
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, bare die chips are susceptible to stress damage. When laying out PCB boards (PCB is the abbreviation of "Printed Circuit Board", the Chinese name is printed circuit boards), there must be no stress-generating components on the back of the die die chip, but high-density In the PCB layout environment, there will be shielding brackets across the back of the bare die chip, which makes the bare die chip vulnerable to stress damage and the reliability of the PCB board.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PCB board and mobile terminal with it

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] Embodiments of the invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0023] Refer below figure 1 A PCB board 100 according to an embodiment of the present invention is described. Wherein, the PCB board 100 can be used in mobile terminals such as mobile phones, tablet computers and the like.

[0024] Such as figure 1 As shown, the PCB board 100 according to the embodiment of the first aspect of the present invention includes: a board body 1 , a bare die chip 2 , a pad (not shown in the figure) and a shielding bracket 3 .

[0025] Wherein, the plate body 1 may be formed as a rectangular plate structure, and the shielding bracket 3 may be formed as a rectangular parallelepiped with an open lower end, but not limited thereto. The ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A PCB board (100) and a mobile terminal (1000) having the PCB board (100), the PCB board (100) comprises: a board body (1), a bare chip (2), a pad, and a shield bracket (3), wherein the bare chip (2) is provided on the lower surface of the plate body (1); the pad is arranged on the upper surface of the plate body (1); the shield bracket (3) is welded with the pad, a yielding groove (31) is provided on the lower surface of the shield bracket (3), and the yielding groove (31) is opposed to the bare chip (2).

Description

technical field [0001] The invention relates to the technical field of electronic products, in particular to a PCB board and a mobile terminal having the same. Background technique [0002] In related technologies, with the rapid development of electronic products, the bodies of electronic products tend to be thinner and lighter, making the internal space layout of electronic products more and more compact. The ultra-thin and high-density trend of electronic products makes more and more bare chips used. However, bare die chips are susceptible to stress damage. When laying out PCB boards (PCB is the abbreviation of "Printed Circuit Board", the Chinese name is printed circuit boards), there must be no stress-generating components on the back of the bare die chips, but high-density In the PCB layout environment, there will be shielding brackets across the back of the bare die chip, making the bare die chip vulnerable to stress damage and improving the reliability of the PCB bo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0271H05K2201/10212H05K9/00
Inventor 黄占肯
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD