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Steel mesh structure used for electronic component reflow soldering

A technology for electronic components and reflow soldering, which is applied in the direction of assembling printed circuits, electrical components, and printed circuits with electrical components. It can solve the problems of electronic components welding position offset, affecting product welding quality, etc., so as to reduce the cost of patching. , simple structure, easy to achieve effect

Inactive Publication Date: 2016-10-26
无锡宇宁智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the final welding position of electronic components is shifted, which affects the welding quality of the product

Method used

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  • Steel mesh structure used for electronic component reflow soldering
  • Steel mesh structure used for electronic component reflow soldering

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Experimental program
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Effect test

Embodiment Construction

[0014] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0015] see figure 1 and figure 2 As shown, in this embodiment, a steel mesh structure used for reflow soldering of electronic components, wherein the electronic components are shrapnel 1 used as a mobile phone connection conduction device, and the bottom of the shrapnel 1 is correspondingly soldered to the PCB circuit board 2 The plate is soldered and fixed by solder paste 3, and the top of the shrapnel 1 is flexible, and it touches the part that needs to be connected to form a path. When the shrapnel 1 is deflected, the top contact point of the shrapnel 1 cannot touch the corresponding position, forming an open circuit.

[0016] The stencil used for printing and welding the solder paste of the shrapnel 1 includes a stencil body 4, and the PCB pad corresponding to the shrapnel 1 on the stencil bo...

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PUM

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Abstract

The invention discloses a steel mesh structure used for electronic component reflow soldering. The structure comprises a steel mesh body. A PCB bonding pad corresponding to each electronic component on the steel mesh body is provided with an opening area. The size of the opening area is cooperated with the size of the PCB bonding pad. At least two through holes used for printing a solder paste are arranged in each opening area. The at least two through holes are arranged independently with an interval. An isolation belt used for increasing a solder paste flowing range is arranged between the two adjacent through holes. The structure of the steel mesh structure used for the electronic component reflow soldering is simple and is easy to realize. A flowable range of the solder paste passing through the reflow soldering and an influence on an electronic component are increased. A paster yield of the electronic component is effectively improved. Simultaneously, a dosage of the solder paste is reduced and cost of the solder paste dosage is saved.

Description

technical field [0001] The invention belongs to the technical field of electronic component welding, and in particular relates to a steel mesh structure used for reflow soldering of electronic components. Background technique [0002] The soldering of electronic components in the patch industry often uses the method of reflow soldering. First, print the solder paste on the position of the pad that needs to be patched, and then use the placement machine to place the electronic components (place the electronic components on the corresponding The position of the pad), and finally complete the soldering through the reflow soldering equipment. The opening method of the stencil determines the screen printing effect of the solder paste, and the printing effect of the solder paste affects the patch effect of the shrapnel after reflow soldering. [0003] At present, the opening methods of the existing stencil are basically based on the shape of the PCB pad, that is, the shape of the...

Claims

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Application Information

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IPC IPC(8): H05K3/34
CPCH05K3/3494H05K2203/048
Inventor 吴银龙
Owner 无锡宇宁智能科技有限公司