A method for laser lossless peeling-off of a flexible substrate

Abstract

The invention discloses a method for laser lossless peeling of a flexible substrate. The method comprises the following steps: a laser peeling-off layer, a heat radiation layer and a flexible substrate are sequentially arranged on a glass substrate; and laser is employed to irradiate on the glass substrate to realize ablation of the laser peeling-off layer so as to realize peeling-off of the flexible substrate from the glass substrate. According to the invention, a lot of heat generated in a laser ablation process can be dissipated in a two-dimensional plane through two-dimensional materials; and transmission of the heat in a direction perpendicular to the two-dimensional plane can be blocked to realize lossless peeling-off of the substrate from the flexible substrate.

Description

technical field [0001] The invention belongs to the technical field of flexible device manufacturing, and in particular relates to a method for laser non-destructive peeling off of a flexible substrate. Background technique [0002] With the continuous updating and development of science and technology, bendable flexible devices made of flexible substrates are expected to become the mainstream equipment of the next generation of optoelectronic devices, such as displays, chips, circuits, power supplies, sensors and other flexible devices can achieve what traditional optoelectronic devices cannot The feature or user experience benefit achieved. Taking flexible display as an example, it is a method of preparing devices on the surface of a substrate made of flexible materials, such as flexible active matrix organic light-emitting diodes or active matrix organic light-emitting diodes (AMOLED), which need to be fabricated on the surface of a hard substrate. The flexible substrate...

AI Technical Summary

Problems solved by technology

Although the scanning size of the laser directly limits the rate of mass production, so far, this method is the only method that can achieve mass production due to its convenient and stable operation and complete peeling.

However, the high energy of the laser and the large amount of heat generated during the peeling process will cause greater damage to the flexible display film and pose a greater threat to the product yield during the application process.

[0004] At present, some existing technical solutions adopt resistance heating sense detachment technology, which uses heating method to detach the substrate from the glass, but the same too high temperature and the need to protect the light-emitting device, resulting in the yield and cost cannot be guaranteed

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