Flame-proof silicone sealant for electronics and its production method

A technology of silicone sealant and manufacturing method, which is applied in the direction of chemical instruments and methods, adhesives, and other chemical processes, which can solve the problems of polymer performance degradation, interface defects, and high surface energy, and achieve mechanical and electrical properties. Improvement , Inhibition of smoke and hydrogen chloride formation, and the effect of improving flame retardancy

Active Publication Date: 2006-11-22
浙江凌志新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the increase of the specific surface area of ​​the particles will lead to high surface energy, and it is easy to aggregate into agglomerates, so that th

Method used

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  • Flame-proof silicone sealant for electronics and its production method
  • Flame-proof silicone sealant for electronics and its production method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0072] Example 1: Add 200 parts by weight of α,ω-dihydroxy polydimethylsiloxane with a viscosity of 20 Pa.s at 25°C and 200 parts of surface-treated magnesium hydroxide and aluminum hydroxide composite powder into the kneader The medium temperature is 150°C, the mixture is dehydrated for 360 minutes, and the base material is obtained after cooling. At room temperature, add the base material to the planetary mixer, then add 2 parts of polydimethylsiloxane, 8 parts of methyltrimethoxysilane, 4 parts of γ-aminopropyltriethoxysilane, and isotitanate. Add 3 parts of propyl ester into the planetary mixer together with the base material and chemically react with the vacuum degree of 0.08 MPa and the rotating speed of 80 revolutions per minute for 4 hours to make the electronic flame retardant silicone sealant. Product performance test results are shown in Table 1.

Example

[0073] Comparative Example 1: All processes are the same as in Example 1, except that 200 parts of untreated composite powder of magnesium hydroxide and aluminum hydroxide are used. Product performance test results are also shown in Table 1.

Example Embodiment

[0074] Example 2: Add 200 parts by weight of α,ω-dihydroxy polydimethylsiloxane with a viscosity of 20 Pa.s at 25°C and 150 parts of surface-treated magnesium hydroxide and aluminum hydroxide composite powder into the kneader The medium temperature is 150°C, the mixture is dehydrated for 360 minutes, and the base material is obtained after cooling. At room temperature, add the base material to the planetary mixer, then add 2 parts of polydimethylsiloxane, 8 parts of methyltrimethoxysilane, 4 parts of γ-aminopropyltriethoxysilane, and isotitanate. Add 3 parts of propyl ester into the planetary mixer together with the base material and chemically react with the vacuum degree of 0.08 MPa and the rotating speed of 80 revolutions per minute for 4 hours to make the electronic flame retardant silicone sealant. Product performance test results are shown in Table 1.

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Abstract

The invention discloses an electronic flame-proof silicone sealing glue and manufacturing method, which comprises the following parts: 100 percent alpha, omega-bihydroxy polysiloxane, 1-50 percent polydimethylsiloxane, 60-200 percent aluminum hydroxide, 60-200 percent magnesium hydroxide, 2-15 percent cross linking agent, 0.2-4 percent silane cross linking agent, 0.1-5 percent catalyst, wherein the aluminum hydroxide and magnesium hydroxide proceed surface disposal. The manufacturing method comprises the steps: first. Synthesizing trimethoxy silane coupling agent with nitrogen; second. Disposing the surface of magnesium hydroxide or aluminum hydroxide; third. Making base material; fourth. Synthesizing the sealing glue.

Description

technical field [0001] The invention relates to an electronic appliance adhesive and a manufacturing method thereof, in particular to a one-component room temperature vulcanized flame-retardant silicone sealant used in manufacturing electronic components and a manufacturing method thereof. Background technique [0002] In recent years, with the rapid development of the electronics industry, electronic equipment is developing in the direction of miniaturization, light weight, high capacity, and high performance. High integration, ultra-miniature, and ultra-thin electronic components have become a trend. It is imperative to use bonding technology instead of traditional connection technology. At the same time, partial discharge and sparking in electronic appliances often cause fire hazards in high-voltage situations; therefore, the requirements for flame retardancy, adhesion and electrical properties of adhesives for electronic appliances are also getting higher and higher. Th...

Claims

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Application Information

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IPC IPC(8): C09J183/14C09J9/00C09K3/10
Inventor 陈世龙
Owner 浙江凌志新材料有限公司
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