Double-isolation heat dissipation type LED down light and implementation method thereof
An LED downlight, heat dissipation technology, applied in lighting and heating equipment, components of lighting devices, and loss prevention measures of lighting devices, etc., can solve problems such as low service life, inconvenient disassembly and assembly, and poor heat dissipation. , to achieve the effect of long service life, good heat dissipation effect and good heat dissipation
Inactive Publication Date: 2016-11-16
HENGDIAN GRP TOSPO LIGHTING
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- Abstract
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- Application Information
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Problems solved by technology
The structure in the prior art will have technical problems such as the PCB board and the light source are packaged together, the heat dissipation is not good, the service life is low, and it is inconvenient to disassemble and assemble.
Method used
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Embodiment 1
[0038] like Figure 1~3 As shown, a double-isolated heat-dissipating LED downlight includes a heat-dissipating shell, a lens is installed in the heat-dissipating shell, and a number of heat-dissipating through holes are provided on the bottom plate of the heat-dissipating shell. There is an LED light source, and there are a number of fixed columns on the bottom side of the heat dissipation shell. The fixed columns are connected to the bottom cover of the driver, and the bottom cover of the driver is connected to the driver cover. The crimping board, the crimping board, the PCB board and the LED light source circuit connection.
[0039] In this embodiment, the heat dissipation housing and the lens are connected by buckles; the area of the heat dissipation through hole accounts for more than 35% of the area of the bottom plate of the heat dissipation housing; the heat dissipation through hole has a rectangular structure.
[0040] In this embodiment, there is a screw hole in...
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Abstract
The invention discloses a double-isolation heat dissipation type LED down light which comprises a heat dissipation shell, wherein a lens is arranged in the heat dissipation shell; a plurality of heat dissipation through holes are formed in a base plate of the heat dissipation shell; air convection heat dissipation is realized between an aluminum substrate and the base plate of the heat dissipation shell; an LED light source is arranged on the aluminum substrate; a plurality of fixing columns are arranged on the side edge of the bottom of the heat dissipation shell and are connected with a driver bottom cover; the driver bottom cover is connected with a driver cover; a PCB is arranged between the driver bottom cover and the driver cover; a wire pressing plate is arranged on the driver cover; and the wire pressing plate, the PCB and the LED light source are in circuit connection with one another. The invention further discloses an implementation method of the double-isolation heat dissipation type LED down light. The double-isolation heat dissipation type LED down light has the characteristics of simple structure, low manufacturing cost, high heat dissipation property, long service life, convenience for assembling and disassembling and the like.
Description
technical field [0001] The invention relates to downlight technology, in particular to a double-isolated heat-dissipating LED downlight and a realization method thereof. Background technique [0002] LED downlight is a product improved and developed on the basis of traditional downlights based on new LED lighting sources. Compared with traditional downlights, it has the following advantages: energy saving, low carbon, long life, good color rendering, and fast response. The design of LED downlights is more beautiful and light. When installing, it can maintain the overall unity and perfection of architectural decoration without destroying the setting of lamps. The light source hides the interior of architectural decoration, the light source is not exposed, and there is no glare. The human visual effect is soft and uniform. [0003] For traditional (Asia-Pacific / Europe / South America) downlights on the market today, the LED light source is mounted on the substrate, and the subst...
Claims
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Patent Timeline
Login to View More IPC IPC(8): F21S8/02F21V5/04F21V15/01F21V17/16F21V23/00F21V29/503F21V29/508F21V29/70F21V29/83F21Y115/10
CPCF21S8/02F21V5/045F21V15/01F21V17/164F21V23/00F21V23/006F21V29/503F21V29/508F21V29/70F21V29/83
Inventor 付佳兵王明徐国栋吴江明
Owner HENGDIAN GRP TOSPO LIGHTING