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Shielding film and pasting method therefor

A technology of shielding film and film layer, applied in the bonding method of surface pretreatment, magnetic field/electric field shielding, electrical components, etc., can solve the problems of waste generation, waste of raw materials, etc., to reduce waste, improve paste efficiency, save The effect of raw materials

Inactive Publication Date: 2016-11-23
深圳市玖联科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the gap between products is large, the use of this full-page pasting method will result in a large amount of waste, resulting in a great waste of raw materials

Method used

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  • Shielding film and pasting method therefor

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Embodiment 1

[0030] Please refer to figure 1 , Embodiment 1 of the present invention is:

[0031] A method for pasting a shielding film. The adhesive film 1 is punched. The adhesive film 1 includes a film layer and an adhesive layer, the adhesive layer is arranged on the film layer, and the adhesive layer is silica gel. The through hole 3 obtained after the adhesive film 1 is punched can be used as a mark and a positioning reference, and the viscosity of the adhesive film 1 is 0.5kgF / cm; the protective film on the shielding film is surface treated to increase the roughness of the protective film surface , so that the adhesive film 1 is closely connected with the protective film on the shielding film, it is convenient to remove the protective film on the shielding film when the adhesive film 1 is removed. The surface roughness Ra of the protective film is 1-3um, and Rz is 3 -5um.

[0032] The shielding film is punched to form a shielding film unit 2, the number of the shielding film unit ...

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Abstract

The invention discloses a pasting method for a shielding film. The method comprises the steps of punching an adhesive film, wherein the adhesive film comprises a film layer and an adhesive layer; punching and cutting the shielding film to form at least one shielding film unit; bonding one surface, provided with a protective film, of the at least one shielding film unit with the adhesive layer on the adhesive film according to an arrangement mode of a to-be-pasted product; pasting one surface, not provided with the protective film, of the shielding film unit bonded with the adhesive layer to the to-be-pasted product; pressing the to-be-pasted product pasted with the shielding film unit; and tearing off the adhesive film and removing the protective film on the shielding film unit. The invention furthermore provides the shielding film. The shielding film is prepared by the pasting method for the shielding film. According to the pasting method for the shielding film, provided by the invention, raw materials can be saved and the pasting effect is good.

Description

technical field [0001] The invention relates to the technical field of shielding films, in particular to a shielding film and a pasting method thereof. Background technique [0002] The shielding film is generally applied to the FPC of the signal transmission type, which can shield the interference of external electromagnetic waves. Affected by the structure and size of electronic products, FPCs generally have irregular shapes. During FPC panel processing, a certain number of FPCs are often arranged in a rectangle, and a waste area will be formed between FPCs and FPCs. The more irregular the shape of the FPC, the larger the area occupied by the waste area. [0003] There are generally two ways of pasting the existing shielding film: 1. Single-piece pasting; 2. Full-page pasting. When using single-piece pasting, you only need to paste the shielding film on the place where the FPC needs to paste the shielding film, which can save the raw materials of the shielding film, but ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00C09J5/02
CPCC09J5/02H05K9/00
Inventor 刘美材王银堂
Owner 深圳市玖联科技有限公司
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