Automatic layout adjustment device

Abstract

The invention relates to an automatic layout adjustment device. The device comprises a suction frame, suction nozzles, a layout adjustment cylinder, a stepped shaft and a return cylinder, wherein the multiple suction nozzles are mounted on the lower side of the suction frame in a sliding fit manner; the layout adjustment cylinder is fixedly mounted on the right side of the suction frame; shaft holes with diameters progressively increased sequentially are formed in all suction nozzles from the second suction nozzle from left to right; the stepped shaft is mounted at an output end of the layout adjustment cylinder, the diameter of the stepped shaft is progressively reduced sequentially from right to left, and the stepped shaft extends into the shaft holes and presses against the right side wall of the first suction nozzle; the return cylinder is mounted on the left side of the suction frame; and an output end of the return cylinder is fixed on the left side wall of the first suction nozzle. The device has the advantages as follows: the distance among the suction nozzles can be adjusted automatically, multiple products can be captured at a time, and the packaging efficiency of the products can be improved.

Description

technical field [0001] The invention relates to the technical field of stamping and packaging of electronic components, in particular to an automatic step adjustment device. Background technique [0002] With the miniaturization trend of electronic products, the use of small components is becoming more and more common, and the application of components has higher requirements for flatness. In order to save the space occupied by the component packaging carrier tape, the carrier tape is usually wound on the disc. [0003] SMD electronic components are usually stamped and formed, and then collected in the feeding mechanism, and then used as a carrier tape for packaging and transportation to meet the high-speed development needs of the SMT production line. Therefore, from production to packaging of SMD electronic components, at least two pieces of equipment are needed, one is stamping equipment, and the other is packaging equipment, so that the two pieces of equipment need at l...

AI Technical Summary

Problems solved by technology

[0004] After the SMD electronic components are punched and formed on the mold, the product is directly picked up by the suction nozzle on the carrier tape for packaging. The packaging efficiency of a single suction nozzle is low, and multiple suction nozzles will be due to the distance between the product on the mold and the load. Inconsistent belt spacing prevents multiple products from being picked up at once for packaging

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