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Heat pump hot water supply device and control method thereof

A technology for a hot water supply device and a heating pump, which is applied in heating and cooling combinations, heat pumps, fluid heaters, etc., can solve problems such as the reduction of the operation efficiency of the heating pump hot water supply device, and achieve the effect of delaying frost formation.

Active Publication Date: 2018-11-27
LG ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, according to the conventional heat pump hot water supply device, since the same refrigeration cycle is always operated regardless of the outside air temperature, the operating efficiency of the heat pump hot water supply device decreases.

Method used

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  • Heat pump hot water supply device and control method thereof
  • Heat pump hot water supply device and control method thereof
  • Heat pump hot water supply device and control method thereof

Examples

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Embodiment Construction

[0042] Specific embodiments of the present invention will be described below with reference to the accompanying drawings. However, the concept of the present invention is not limited to the disclosed embodiments, and those skilled in the art who understand the concept of the present invention can easily suggest other embodiments within the scope of the same concept.

[0043] figure 1 is a system diagram showing the structure of a heat pump hot water supply device according to an embodiment of the present invention, figure 2 is a perspective view showing the structure of a water-refrigerant heat exchanger according to an embodiment of the present invention, image 3 It is a schematic diagram schematically showing the state of the internal flow path of the water-refrigerant heat exchanger according to the embodiment of the present invention.

[0044] refer to figure 1, the heat pump hot water supply device 10 in the embodiment of the present invention includes: a first refri...

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Abstract

The present invention provides a heat pump hot water supply device and its control method. The heat pump hot water supply device according to the embodiment of the present invention includes: a first refrigerant circulation system, in which a first refrigerant circulates, and includes a first A compressor, an outdoor heat exchanger, and a first expansion device; a second refrigerant circulation system, which circulates a second refrigerant, and includes a second compressor and a second expansion device; a water refrigerant heat exchanger, in which the first The first refrigerant compressed by the compressor and the second refrigerant compressed by the second compressor flow into the water refrigerant heat exchanger; the water inlet flow path is combined with one of the water refrigerant heat exchangers side, and the supply water flows into the water inlet flow path; and the water outlet flow path, which is combined with the other side of the water refrigerant heat exchanger, and is used to discharge the heat exchanged in the water refrigerant heat exchanger water.

Description

technical field [0001] The invention relates to a heating pump hot water supply device and a control method thereof. Background technique [0002] Generally speaking, a heat pump hot water supply device is understood as a device that utilizes a heat pump to perform hot water supply to supply high-temperature outlet water or perform indoor floor heating. The heat pump described above can drive a refrigeration cycle in which refrigerant is compressed, condensed, expanded, and evaporated. [0003] In addition, when the outside air temperature is relatively low, the above-mentioned heat pump hot water supply device can be used more. Also, depending on the range of outside air temperature, the required outlet water temperature will be different. [0004] As an example, in winter and other seasons when the outside air temperature is very low, the user may require a higher outlet water temperature, and in spring or autumn when the outside air temperature is relatively high, the u...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B29/00F25B47/02F25B49/02F24H4/02
CPCF25B30/02F25B49/022F25B2339/047F25B2400/0403F25B2400/061F25B2600/0251F25B2600/0253F25B2600/2501F25B2700/2106F25B2700/21161F25B2700/21163F25B2500/31F28D9/0093F28D2021/007F24H4/02F24H9/2007F25B13/00Y02B30/70F25B7/00Y02B30/12F25B49/02F24H15/32F24H15/281
Inventor 黄畯铉
Owner LG ELECTRONICS INC
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