Grain positioning arrangement device and grain positioning arrangement method

An arrangement method and technology of grains, which are applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problems of limited overall speed and slow down the speed of the robot arm to arrange grains, so as to reduce production costs and reduce The number of moves back and forth, the effect of increasing the speed

Active Publication Date: 2021-04-30
SAULTECH TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This has seriously slowed down the speed at which the mechanical arm arranges the grains, resulting in a limitation of the overall speed. For the semiconductor industry with extremely high production capacity requirements, it is an important link that urgently needs to be improved.

Method used

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  • Grain positioning arrangement device and grain positioning arrangement method
  • Grain positioning arrangement device and grain positioning arrangement method
  • Grain positioning arrangement device and grain positioning arrangement method

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Embodiment Construction

[0041] based on the following Figure 1 to Figure 4 , and the embodiment of the present invention will be described. This description is not intended to limit the embodiment of the present invention, but is one of examples of the present invention.

[0042] refer to figure 1 as well as figure 2 As shown, a die positioning arrangement device 100 according to an embodiment of the present invention is used to position a plurality of dies D on a region R of a substrate S to be placed. The device for positioning the grain 100 includes a supporting member 1 , an arrangement mechanism 2 , a transposition mechanism 3 , and a controller 4 electrically connecting the arrangement mechanism 2 and the transposition mechanism 3 . The supporting member 1 is an intermediate carrier responsible for carrying a plurality of dies D, and has a supporting surface 11 on which the plurality of dies D are arranged. The supporting member 1 can be, for example, an adhesive tray, or a member compose...

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PUM

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Abstract

The invention provides a device for positioning and arranging crystal grains that increases the efficiency of positioning and arranging, and a method for positioning and arranging crystal grains using the device, which are used to position a plurality of crystal grains in a region to be arranged on a substrate, and support a plurality of crystal grains through a supporting member. Die, the transposition mechanism transposes the supporting member, and can achieve the effect of positioning multiple dies on the substrate in a short time, thus greatly increasing the speed of die arrangement, increasing production capacity, and indirectly reducing production costs.

Description

technical field [0001] The invention relates to a crystal grain positioning arrangement device and a crystal grain positioning layout method, in particular to a crystal grain positioning layout device and a crystal grain positioning layout method which increase the positioning layout efficiency. Background technique [0002] In the manufacturing process of semiconductor wafer level packaging, the wafer must be cut into a plurality of dies, and then the good products are picked out and reconfigured on the circular substrate for subsequent processing. Since the dies are redistributed (redistribution), winding, balling, etc. after reconfiguration, the dies must be positioned very precisely on the substrate. Generally speaking, the error is required to be controlled within 2 microns. In the prior art, a position on the substrate is selected, a mechanical arm is used to pick up a grain, and then the grain is placed at the position selected by the controller. It is conceivable t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/68
Inventor 卢彦豪
Owner SAULTECH TECH
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