Crimp terminal, semiconductor device, power conversion device, and method of manufacturing crimp terminal
A semiconductor and terminal technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, circuits, etc., can solve problems such as the decrease in the strength of crimping terminals
Active Publication Date: 2019-06-25
MITSUBISHI ELECTRIC CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0005] However, in the above-mentioned conventional structure, stress acts on the crimp terminal due to the application of torsion.
There is a problem that the strength of the crimped terminal is lowered because additional stress is applied compared to the case without twisting
Method used
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Embodiment Construction
[0036] First, a comparative example with respect to the embodiment will be described.
[0037] Figure 8 It is a diagram showing a semiconductor device according to a comparative example with respect to the embodiment, and is an internal structural diagram of an intelligent semiconductor device (IPM) incorporating a printed wiring board 14 . Figure 9 as well as Figure 10 It is a figure which shows the solder terminal 250 (relay terminal 250) which concerns on the comparative example with respect to embodiment. Figure 8 The semiconductor device has a frame body 12, a base plate 16 made of Cu, a semiconductor element (semiconductor chip) 32, a substrate (insulating substrate) 30, and wires 22 through which solder terminals 250 and semiconductor element 32 are electrically connected.
[0038] However, in recent years, the demand for non-soldering has increased, and therefore, pressure bonding, rather than the above-mentioned soldering method, has attracted attention. The crim...
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Provided are a crimp terminal capable of orienting a crimp portion at a desired angle and having high strength, a semiconductor device having the crimp terminal, a power conversion device, and a method of manufacturing the crimp terminal. After the plate material (60) for crimping terminals is manufactured, its root portion (51) and main body portion (53) are then bent. The main body part (53) is made to stand up from the root part (51) at the end part of the root part (51), and the crease (52) is made to incline with respect to the length direction axis of the root part (51). Thereby, the crimp terminal (50) shown in FIG. 3 can be formed. According to this embodiment, by bending the crimp terminal (50) punched out by a die as shown in FIG. A crimp terminal (50) that forms an angle (θ) other than 90°.
Description
technical field [0001] The present invention relates to a press fit terminal, a semiconductor device, a power conversion device, and a method for manufacturing a press fit terminal. Background technique [0002] Conventionally, as a common method of connecting a printed wiring board (PCB) and external components, a method of inserting solder terminals into through holes and then soldering them is used. However, in recent years, the demand for solder-free bonding has increased, so the pressure bonding method, not the soldering method, has attracted attention. In crimp bonding, contact between the printed wiring board and the terminal is performed by the contact stress of the crimped terminal. [0003] In International Publication No. 2014 / 132803 Figure 8 et al. describe a technique of providing a reduced-diameter structure in a part of a crimp terminal. By twisting the crimping part with this reduced-diameter configuration as a starting point, the surface of the crimping p...
Claims
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IPC IPC(8): H01L23/053H01L25/07
CPCH01L23/053H01L25/072H01L23/562H01L2224/48137H01L2224/48229H01L2924/181H01L2924/00012H01L2224/48091H01R12/585H01L2924/00014H01L23/49838H01L23/49541H01L23/49551H01R12/7064
Inventor 木村义孝米山玲山下秋彦
Owner MITSUBISHI ELECTRIC CORP