Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and system for applying current limiting in multi-core chip

A technology of current limitation and application method, which is applied in the electronic field, can solve problems such as the inability to reduce the current of multi-core chips, and achieve the effect of reducing the number of threads and reducing the current

Inactive Publication Date: 2017-01-04
李媛媛
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] An application method of current limitation in a multi-core chip is provided, which solves the shortcoming that the current reduction of the multi-core chip cannot be realized in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and system for applying current limiting in multi-core chip
  • Method and system for applying current limiting in multi-core chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] refer to figure 1 , figure 1 A flowchart of an application method of current limitation in a multi-core chip provided by the first preferred embodiment of the present invention, the method is completed by an electronic chip, the method is as follows figure 1 shown, including the following steps:

[0027] Step S101, detecting the current of each core and the running thread;

[0028] Step S102, judging whether the current of the core exceeds the curren...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method and a system for applying current limiting in a multi-core chip. The method comprises the following steps of detecting the current and running thread of each inner core; judging whether the current of each inner core exceeds a current threshold value or not; when the current of each inner core exceeds the current threshold value, reducing the number of the threads of the corresponding inner core. By adopting the technical scheme, the method has the advantage that the current is effectively reduced.

Description

technical field [0001] The invention relates to the field of electronics, in particular to an application method and system for current limitation in multi-core chips. Background technique [0002] Chip, English is Chip; chipset is Chipset. A chip generally refers to the carrier of an integrated circuit, and is also the result of the design, manufacture, packaging, and testing of an integrated circuit. It is usually an independent whole that can be used immediately. The two words "chip" and "integrated circuit" are often used together. For example, in common discussion topics, integrated circuit design and chip design have the same meaning, and the chip industry, integrated circuit industry, and IC industry often have the same meaning. . In fact, the two terms are related as well as different. Integrated circuit entities often exist in the form of chips, because integrated circuits in a narrow sense emphasize the circuit itself, such as a phase-shift oscillator that is as...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/32
CPCG06F1/3206G06F1/329
Inventor 李媛媛
Owner 李媛媛
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products