Wafer-Level Lens Structure for Contact Image Sensing Module

Abstract

The present invention relates to a wafer-level lens structure of a contact type image sensing module. The wafer-level lens structure comprises a circuit board and an image sensor, the image sensor is electrically connected with the circuit board and comprises a circuit area and a photosensitive area, and the photosensitive area comprises a photoelectric conversion array on which a first lens array is configured. The first lens array is composed of a plurality of first lens covers, the first lens covers have the first curved surfaces respectively, and an aperture array is configured on the first lens array. The aperture array is equipped with a plurality of aperture holes, and the aperture holes expose the first curved surfaces externally and control the incident light quantity. By configuring a wafer-level lens in the photosensitive area of the image sensor, the wafer-level lens structure of the contact type image sensing module provided by the present invention is not limited by that the object distance is equal to the image distance, the size of a module can be shrunk, the imaging quality is improved, and the cost is reduced.

Description

technical field [0001] The present invention relates to a sensing device, in particular to a wafer-level lens structure of a contact image sensing module without a rod lens. Background technique [0002] Contact image sensor (Contact Image Sensor, CIS) is a kind of linear image sensor, which is used to scan flat images or documents into electronic format for storage, display or transmission. Its main applications are scanners and fax machines And multi-function business machines, etc. [0003] The working principle of the contact image sensor is to irradiate the light generated by a light source onto the manuscript to be scanned, reflect the light through the manuscript, and use a lens group to gather the reflected light on a charge-coupled device (Charge-CoupledDevice, CCD) or It is a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS) and other photosensitive components, which use the photosensitive component to change the light signal ...

AI Technical Summary

Problems solved by technology

[0008] 1. At present, contact image modules all use rod lens array (rod lens) 4a, and its focal length is controlled by its material / circle diameter, and the module size cannot be reduced any further;

[0009] 2. The traditional rod lens 4a generally emits a matrix lens, which has poor image quality and high cost;

[0011] 4. The depth of field of the rod lens itself is relatively short, so the size requirements of the housing must be tightened, which will greatly affect the production pass rate and cost;

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