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Shielding cover, packaging structure and manufacturing method of packaging structure

A technology of packaging structure and shielding cover, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as poor heat dissipation effect, and achieve the effect of avoiding electrostatic interference

Active Publication Date: 2019-04-26
AVARY HLDG (SHENZHEN) CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The shielding cover surrounds the package component, and there is a gap between the shield cover and the package component, so that the heat dissipation of the package component can only be dissipated through the package substrate, resulting in poor heat dissipation effect

Method used

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  • Shielding cover, packaging structure and manufacturing method of packaging structure
  • Shielding cover, packaging structure and manufacturing method of packaging structure
  • Shielding cover, packaging structure and manufacturing method of packaging structure

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Embodiment Construction

[0018] The shielding case, the packaging structure, the manufacturing method of the shielding case and the manufacturing method of the packaging structure provided by the present invention will be described in detail below in conjunction with specific embodiments.

[0019] The manufacturing method of the packaging structure 100 provided by the present invention includes steps:

[0020] For the first step, please also refer to figure 1 and figure 2 , providing a shielding case 10 .

[0021] The shielding case 10 is roughly a square shell structure. A receiving space 12 is enclosed inside the shielding case 10 . An opening 11 is opened on one side of the receiving space 12 . The cover body of the shielding cover 10 includes a four-layer structure, including a base layer 13 , a bonding layer 14 , a shielding layer 15 and an adhesive layer 16 from outside to inside. The bonding layer 14 is located between the base layer 13 and the shielding layer 15 for bonding the base laye...

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PUM

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Abstract

The invention relates to a shielding cover. A containing space is arranged in the shielding cover, one side of the containing space is provided with an opening, the shielding cover comprises a shielding layer and a base layer and a bonding layer respectively located at two sides of the shielding layer, the shielding layer is a grid structure, the shielding layer comprises a grounding end extending towards the opening, and the bonding layer is pressure-sensitive heat and electricity conduction colloid. The invention also relates to a packaging structure and a manufacturing method of the packaging structure.

Description

technical field [0001] The invention relates to the field of electronic packaging, in particular to a shielding case, a packaging structure with the shielding case and a manufacturing method for the packaging structure with the shielding case. Background technique [0002] In the field of electronic packaging, in order to prevent external radiation sources from affecting the normal operation of the packaged components, or to reduce the interference of the packaged components to other electronic components, a shielding cover is usually placed on the packaged component. At present, the shielding cover is generally made of alloys such as stainless steel or nickel-nickel copper. The shielding cover surrounds the package component, and there is a gap between the shield cover and the package component, so that the heat dissipation of the package component can only be dissipated through the package substrate, resulting in poor heat dissipation effect. Contents of the invention ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/10H01L23/31H01L23/60H01L21/52
Inventor 胡先钦何明展
Owner AVARY HLDG (SHENZHEN) CO LTD
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