A shielding layer cancellation device and cancellation method suitable for segmented electroplating

Abstract

The invention discloses a shielding layer removing device applicable to sectionalized electroplating and a removing method thereof. The shielding layer removing device comprises a base. A workpiece fixing mechanism, a position adjusting mechanism, a photocuring mechanism and a tool setting mechanism are arranged on the base. The tool setting mechanism is driven to execute tool setting on a workpiece which is installed and connected to a motor output shaft and coated with a photosensitive shielding layer through the position adjusting mechanism. The portion, at the to-be-electroplated portion of the workpiece, of the shielding layer is removed through the photocuring mechanism. By adoption of the shielding layer removing device applicable to sectionalized electroplating and the removing method thereof, the shielding layer on the surface of the workpiece can be removed efficiently at the high precision, the workpiece is not damaged, the performance and precision of the workpiece are not affected, and precise sectionalized electroplating can be achieved.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to a shielding layer canceling device suitable for segmental electroplating and a canceling method thereof. Background technique [0002] With the development of the grinding and electroplating process, due to various requirements on the surface of the product, it is sometimes necessary to electroplate multiple coating materials on a workpiece, and it is necessary to shield other parts of the workpiece when electroplating one of the coatings. This method is also used Called segmental plating. The common manufacturing method of segmented electroplating tools is to wrap the entire workpiece with insulating materials such as plastic film, and then manually remove part of the shielding layer to expose the part to be electroplated, and then electroplate with a specific process. In current production, most of the process is done manually, which has high labor costs, lo...

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Problems solved by technology

[0003] For example, the shielding method of the workpiece surface in the workpiece electroplating process described in the CN 102797022A patent is to use an insulating coating that is insoluble in water and insoluble in weak acid liquids as the shielding layer, but this method uses manual cancellation when the shielding layer is canceled, and the accuracy is low , low efficiency, low yield

In addition, in the workpiece electroplating process described in CN 103111944A patent, the removal method of the shielding layer on the workpiece surface is to use an organic solvent as the degumming solvent to soak the electroplating grinding head with a shielding plastic film, and the shielding plastic film is soaked in the degumming solvent. Swell or dissolve to realize the removal of the shielding layer, but the plastic film is manually wrapped on the workpiece in this process, the shielding layer obtained by this method is not uniform, the removal time is different in different positions, and the efficiency is low

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