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Nickel colloidal catalyst solution for electroless nickel or nickel alloy and method for electroless nickel or nickel alloy

A technology of electroless nickel plating and nickel alloy, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve problems such as chemical plating not mentioned

Active Publication Date: 2019-05-10
ISHIHARA CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0024] However, the chemical coating is not mentioned in the examples

Method used

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  • Nickel colloidal catalyst solution for electroless nickel or nickel alloy and method for electroless nickel or nickel alloy
  • Nickel colloidal catalyst solution for electroless nickel or nickel alloy and method for electroless nickel or nickel alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 13

[0130] Examples 13 to 14 are based on Example 9, Example 13 is an example of changing the type of nickel salt, and Example 14 is an example of using a borohydride compound and hypophosphorous acid as a reducing agent.

[0131] In addition, as mentioned above, Examples 21 to 22 are examples of the electroless nickel-cobalt alloy plating method. Among them, in Example 21, after the pretreatment process of decontamination and neutralization, the adsorption promotion→catalyst application→chemical Each process of the coating film, the pretreatment process, the adsorption promotion process, and the catalyst application process are based on the above-mentioned Example 1. Embodiment 22 is based on the above-mentioned embodiment 21, and is an example in which the nickel colloid catalyst solution is changed from embodiment 1 to the catalyst solution of embodiment 18.

[0132]On the other hand, among the following Comparative Examples 1 to 3, Comparative Example 1 is a blank example in w...

Embodiment 1

[0134] The electroless nickel plating method of the present invention is characterized in that the steps of adsorption promotion→catalyst application→electroless plating are sequentially carried out, and this Example 1 is an example of further performing the pretreatment steps of decontamination and neutralization before the adsorption promotion step.

[0135] That is, after pretreatment under the following condition (p), adsorption promotion is performed under condition (a), catalyst application is performed under condition (b), and then electroless nickel-phosphorus plating is performed under condition (c).

[0136] (p) Pretreatment process

[0137] First, on a double-sided copper-clad glass-epoxy resin substrate (FR-4 manufactured by Panasonic Electric Works Co., Ltd., thickness: 1.0 mm), remove 35 μm of copper foil by dissolving and desmearing / neutralizing substrate as the sample substrate.

[0138] The compositions of the desmutting treatment liquid and the neutralizatio...

Embodiment 2

[0175] Based on above-mentioned embodiment 1, prepare nickel colloidal catalyst liquid according to following composition, except that, the preparation method of nickel colloidal catalyst liquid and electroless nickel plating liquid and the processing condition of each operation are set to be identical with embodiment 1.

[0176] (b) Preparation of nickel colloidal catalyst solution

[0177] [nickel solution]

[0178] Nickel sulfate (as Ni 2+ 0.1 mol / L): 0.1 mol / L

[0179] Citric acid: 0.15 mol / L

[0180] [reducing agent solution]

[0181] Sodium borohydride: 0.2 mol / L

[0182] [Preparation conditions of nickel colloidal catalyst solution]

[0183] Same as Example 1.

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Abstract

The invention provides a nickel colloidal catalyst solution for electroless nickel plating or nickel alloy. After immersing a non-conductive substrate in a liquid containing a surfactant and performing an adsorption promotion treatment in advance, use a catalyst solution containing (A) a soluble nickel salt, (B) Electroless nickel plating of reducing agent and (C) colloidal stabilizer A nickel colloidal catalyst solution is used to provide a catalyst to a non-conductive substrate, and then perform electroless nickel plating. After the catalytic activity is enhanced by the adsorption-promoting pretreatment, a catalyst solution with excellent temporal stability is used for catalyst application, and then electroless plating is performed, so that a uniform nickel coating without color spots can be obtained. Even if it is used as a nickel alloy plating method instead of the above-mentioned nickel plating method, a nickel alloy film having excellent uniformity can be obtained.

Description

technical field [0001] The present invention relates to a nickel colloid catalyst solution used as a catalyst for pretreatment when performing electroless nickel or nickel alloy plating on a non-conductive substrate, and an electroless nickel or nickel alloy plating method using the catalyst solution, providing a nickel colloid catalyst A nickel colloid catalyst solution for electroless nickel or nickel alloy plating and an electroless nickel or nickel alloy plating method that have excellent stability over time of the solution and can form a nickel or nickel alloy film with a uniform and non-stained appearance. Background technique [0002] In order to represent resin substrates such as glass-epoxy resin, glass-polyimide resin, epoxy resin, polyimide resin, polycarbonate resin, ABS resin, PET resin, etc., including glass substrates, ceramic substrates, etc. Electroless nickel or nickel alloy plating is carried out on the non-conductive substrate inside. The conventional met...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/30C23C18/32
CPCC23C18/30C23C18/32C23C18/1639C23C18/34C23C18/36C23C18/50
Inventor 内田卫田中薰川端爱
Owner ISHIHARA CHEM
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