6results about How to "Fully conductive" patented technology

The invention relates to a device and a process method for preventing a conductive roller from electroplating metal. The device comprises an electroplating bath body, and a front conductive roller assembly and a rear conductive roller assembly are arranged in the electroplating bath body in a mirroring manner; each of the front conductive roller assembly and the rear conductive roller assembly is at least provided with a positioning roller completely immersed in the electroplating liquid and a conductive roller component arranged above the electroplating bath body, and is in contact with the roller surfaces of the conductive roller components and the positioning rollers in the front conductive roller assembly and the rear conductive roller assembly in sequence through coating raw materials; the coating raw material also passes through a cleaning device between the rear conductive roller and the positioning roller; an electroplating anode is further arranged in the electroplating bath body and at least provided with an upper anode plate and a lower anode plate, and coating raw materials connected between the positioning rollers in the front conductive roller assembly and the positioning rollers in the rear conductive roller assembly pass through the space between the upper anode plate and the lower anode plate. Conductive roller components in the front conductive roller assembly and the rear conductive roller assembly are connected to a power supply cathode, and the lower anode plate and the upper anode plate are connected to a power supply anode.

The invention relates to oxide-containing copper microparticles, a method for producing the same, and a method for producing a sintered body of copper microparticles. Oxide-containing copper microparticles which contain Cu64O and, if necessary, Cu2O, and which are coated with a carboxylic acid, in which the mass ratio of Cu64O to the total mass of Cu, Cu64O, and Cu2O is 0.5-2.0 mass%, and the mass ratio of Cu2O to the total mass of Cu, Cu64O, and Cu2O is more than 0 mass% and less than 0.5 mass%.

The copper alloy sheet material has an alloy composition containing 0.10 mass% to 1.00 mass% of Cr, with the remainder being Cu and unavoidable impurities, the average value of the orientation density of beta-fiber ([phi] 2 = 45 DEG to 90 DEG) measured by the EBSD method being 6.0 to 10.0, the tensile strength in the direction parallel to rolling being 420 MPa to 700 MPa, and the conductivity being 65% IACS to 90% IACS.

The present invention discloses a spring-type conductive track structure and a PCB plating device. The spring-type conductive track structure comprises: a fixed conductive track, a movable conductive strip, and a plurality of conductive blocks and conductive springs. The plurality of conductive blocks and conductive springs are arranged between the fixed conductive track and the movable conductive strip along the length direction of the fixed conductive track. The conductive blocks are electrically connected to the corresponding conductive springs. When the movable conductive strip is translated relative to the fixed conductive track, under the elastic action of the corresponding conductive springs, the conductive blocks and the corresponding conductive springs are electrically connected to the fixed conductive track to conduct current. The scheme of the present invention not only ensures the contact area during transmission, but also reduces the occurrence of poor contact due to insufficient processing accuracy. At the same time, the conductive springs are used to connect the small conductive blocks. When working, the conductive springs will press the small conductive blocks to ensure that they are fully in contact and conductive, thereby achieving the purpose of conducting the components during movement. In addition, the wear of the track will not affect the conductive performance.

The utility model discloses a kind of soft-start control circuit based on output voltage feedback, soft-start control circuit includes buffer circuit and control circuit, the buffer circuit includes operational amplifier;The buffer circuit is used to prevent the overshoot phenomenon of output voltage, makes output voltage curve change smooth;The control circuit includes capacitor, control tube, voltage divider component and discharge tube, the capacitor is connected with the drain of the discharge tube and the operational amplifier, the voltage divider component is connected with the capacitor and the control tube respectively;The control circuit is used to control soft-start time.The utility model can improve the response speed of soft-start control circuit, avoid appearing output voltage overshoot phenomenon;And it can accurately control soft-start time, effectively controllable limit in power-on process inrush current.

The invention relates to oxide-containing copper microparticles, a method for producing the same, and a method for producing a sintered body of copper microparticles. Oxide-containing copper microparticles which contain Cu64O and, if necessary, Cu2O, and which are coated with a carboxylic acid, the mass ratio of Cu64O to the total mass of Cu, Cu64O, and Cu2O being 0.5-2.0 mass%, and the mass ratio of Cu2O to the total mass of Cu, Cu64O, and Cu2O being 0 mass%.