server
A server and processor technology, applied in the server field, can solve problems such as increasing manufacturing costs, not meeting economic benefits, and affecting operating efficiency
Active Publication Date: 2019-06-28
INVENTEC PUDONG TECH CORPOARTION +1
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Problems solved by technology
In this case, when the heat dissipation airflow blown by the server fan flows into this open area, it will dissipate and become turbulent, not only part of the heat dissipation airflow will be shunted to other non-intended heat dissipation areas, so that the heat dissipation airflow is scheduled to pass through The heat dissipation area of the system cannot be properly dissipated, which will cause the temperature of the entire servo system to rise and affect the operating performance
[0004] In response to this problem, some operators replace the fan with a high-power fan, or increase the speed of the fan to make up for the cooling airflow required by the cooling area. However, this method not only increases the overall manufacturing cost, but also increases the energy consumption of the server. In line with actual economic benefits
Method used
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[0052] The specific implementation manner of the present invention will be described in more detail below with reference to schematic diagrams. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.
[0053] The following will disclose the embodiments of the present invention with figures, and for the sake of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details are not intended to limit the invention. In addition, for the sake of simplifying the drawings, some commonly used structures and components will be shown in a simple and schematic way in the drawings, and some of the drawings even omit structures such as ...
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The invention provides a server, which includes a main chassis, a fan module, two processor mounting bases and a wind deflector. The fan module is accommodated in the accommodation space of the main chassis. The processor installation seat is accommodated in the accommodation space and adjacent to the air outlet side of the fan module. The wind deflector has a mounting seat and a flow guiding assembly connected to each other, the air guiding assembly is detachably pivoted on the mounting seat, so that the flow guiding assembly can swing relative to the mounting seat and selectively switch between multiple air guiding positions . The processor mounting base can be used to selectively install the processor module or the shroud, and the shroud can be detachably installed on the processor mounting base without the processor module through the mounting base, and the shroud assembly is located on one of them. The position of the air guide enables the heat dissipation airflow from the side of the air outlet to be guided and concentrated by the air guide assembly.
Description
technical field [0001] The invention relates to a server, in particular to a server with a shroud. Background technique [0002] At present, cloud technology and its applications can be seen everywhere in daily life. The vigorous development of various services and networked devices has made everyone's information usage more and more large. Servers have played a very important role behind the entire cloud industry. . In order to expand performance in the future, the server is usually equipped with multiple processor mounts, so that users can expand processors according to requirements. [0003] But in practice, usually not all processor mounts in a single server are equipped with processors. Therefore, there will be an empty area above the processor mount where no processor is installed. In this case, when the heat dissipation airflow blown by the server fan flows into this open area, it will dissipate and become turbulent, not only part of the heat dissipation airflow wi...
Claims
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IPC IPC(8): G06F1/18G06F1/20G06F1/3234
CPCG06F1/183G06F1/20G06F1/325H05K7/20172H05K7/20727H05K7/20145
Inventor 彭秉威黄文龙
Owner INVENTEC PUDONG TECH CORPOARTION