Identification control method and device of semiconductor technical segment

A control method and technology of the process section, applied in the direction of manufacturing computing systems, instruments, data processing applications, etc., can solve problems such as scrap, product yield reduction, product processing errors, etc.

Inactive Publication Date: 2017-03-22
PEKING UNIV FOUNDER GRP CO LTD +1
View PDF3 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a method and device for identifying and controlling semiconductor process sections, which are used to solve the probl

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Identification control method and device of semiconductor technical segment
  • Identification control method and device of semiconductor technical segment
  • Identification control method and device of semiconductor technical segment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments . Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] In the embodiment of the present invention, Recipe refers to the process menu, Recipe_ID refers to the identification of the process menu, and the process section includes the front-end process and the back-end process. For the process of circuit engraving, the machine process menu includes the process attributes of the front-end process or the process attributes of the back-end process. Dispatch is the action of dispatching workers...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an identification control method and device of a semiconductor technical segment. The method comprises that description information of a workpiece to be dispatched is obtained, and the description information comprises a Recipe_ID of the workpiece to be dispatched; correspondence between preset Recipe_IDs and a machine Recipe is obtained, a machine included by the machine Recipe corresponding to the Recipe_ID of the workpiece to be dispatched is determined according to the Recipe_ID of the workpiece to be dispatched, and the machine Recipe includes a technical attribute of a technical segment corresponding to the workpiece to be dispatched; and the workpiece to be dispatched is dispatched to the machine, and the machine is controlled to process the workpiece to be dispatched according to the technical attribute of the technical segment corresponding to Recipe_ID of the workpiece to be dispatched. Thus, the machine is prevented from identification mistakes of the technical segments during processing, processing errors of the machine are avoided, and the processing efficiency of the machine and the yield of products are improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor process section identification control method and device. Background technique [0002] At present, in the semiconductor manufacturing industry, semiconductor manufacturing factories have to produce a wide variety of semiconductor devices in different quantities at the same time, and the processing techniques of various types of semiconductors are different, and the processing time periods and processing quantities are also different. [0003] With the continuous increase of output, one machine may allow the production of many different types of products, and each step of each product corresponds to a specific process menu, that is, a machine corresponding to specific production conditions such as temperature and humidity. This requires the machine to switch back and forth between different states. It is possible that the machine is in the stat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G06Q10/06G06Q50/04
CPCY02P90/30
Inventor 詹祥宇
Owner PEKING UNIV FOUNDER GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products