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MEMS microphone chip and MEMS microphone

A microphone and chip technology, applied in the field of micro-electromechanical, can solve the problems of microphone failure, connection part, back electrode diaphragm damage, lower yield rate, etc., and achieve the effect of improving the anti-blowing ability

Inactive Publication Date: 2017-03-22
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the blowing process, because the back cavity is isolated by the connecting part, the lateral movement of the blowing air flow is not smooth, resulting in local high pressure, which will cause damage to the connecting part, back pole or diaphragm
Causes the microphone to fail and reduces the yield

Method used

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  • MEMS microphone chip and MEMS microphone
  • MEMS microphone chip and MEMS microphone
  • MEMS microphone chip and MEMS microphone

Examples

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Embodiment Construction

[0027] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0028] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0029] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0030] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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PUM

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Abstract

The present invention discloses an MEMS microphone chip and an MEMS microphone. The microphone chip comprises a substrate, a back pole and a diaphragm. The back pole and the diaphragm separately form two electrodes of a capacitor. The back pole and the diaphragm are suspended above the substrate. The back pole is between the substrate and the diaphragm. The substrate has a back cavity and a support post. The support post is connected with the side wall of the back cavity by using a connecting part. The connecting part has a through hole or a notch penetrating in a thickness direction, so as to enable spaces at two sides of the connecting part to be communicated with each other. The support post is configured for supporting the back pole. The MEMS microphone chip has good anti-blowing performance. The MEMS microphone comprises the MEMS microphone chip.

Description

technical field [0001] The present invention relates to the field of micro-electromechanical technology, and more specifically, to a MEMS microphone chip and a MEMS microphone using the chip. Background technique [0002] Existing MEMS microphones mainly use silicon or polysilicon as structural materials to form diaphragms or back poles. The back electrode and the vibrating membrane are arranged on a common substrate, and the common substrate has a back cavity, and a support column is provided in the back cavity, and usually the support column is connected with the side wall. The connection part isolates the back cavity, and some dust will enter the microphone during the production process, which will affect the product quality. In order to remove dust, the PCB board needs to be cleaned with an air gun during the assembly process. [0003] During the blowing process, because the back cavity is isolated by the connecting part, the lateral movement of the blowing air flow is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04
CPCH04R19/04H04R2201/003H04R19/005H04R31/00B81B2201/0257B81B7/0029B81B2203/0127B81B2203/033B81B2203/0353H04R1/04H04R2307/025
Inventor 詹竣凱李江龙蔡孟錦
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD