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Silicon microphone

A silicon microphone and component technology, applied in semiconductor electrostatic transducers, electrostatic sensors, electrostatic transducer microphones, etc., can solve the problems of affecting frequency response characteristics, hidden dangers of anti-blowing ability, easy accumulation of blocked foreign objects, etc., to achieve The effect of improving performance, increasing effective opening ratio, and improving the ability to resist blowing

Pending Publication Date: 2019-08-23
MEMSENSING MICROSYST SUZHOU CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 1. Process the inward or outward tongue-like piece at the sound inlet of the shell to block foreign objects. The disadvantage of this method is that it only changes the flow direction of the airflow, and the foreign object blocking efficiency is not high, and this structure leads to the sound inlet hole. The opening ratio is low, which affects the frequency response characteristics
[0008] 2. The shell is stamped inward to form a groove. The disadvantage of this method is that although it can prevent the direct entry of foreign matter from the environment, the blocked foreign matter is easy to accumulate in the groove, and there are greater hidden dangers during use.
[0009] 3. The traditional products with opening holes in the shell, due to the hidden dangers of foreign matter and anti-blowing ability, the diameter of the opening is about 800 μm, and the effect of blocking foreign matter is not good.

Method used

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Embodiment Construction

[0026] The specific implementation of the silicon microphone provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0027] figure 1 is a schematic diagram of the external structure of an embodiment of the silicon microphone of the present invention, figure 2 is along figure 1 Schematic diagram of the cross-section along the direction A~A.

[0028] see figure 1 and figure 2 , The silicon microphone of the present invention includes a component 10 and a sensor 11 , the component 10 and the sensor 11 form a sound cavity. In this embodiment, the component 10 is the shell of the silicon microphone. In other embodiments of the present invention, the component 10 can also be other structures of the silicon microphone, as long as the technical problems of the present invention can be solved. That's it.

[0029] Specifically, in this embodiment, the silicon microphone further includes a circuit board 12 and an ASIC chi...

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Abstract

The invention provides a silicon microphone, which takes a convex part with a pickup hole and a conduction cavity as a sound inlet hole, can change the flow direction of air flow formed by external sound vibration, and can reduce the intensity of the air flow, thereby preventing high-intensity air flow from directly entering the sound cavity, and improving the anti-blowing capability of the silicon microphone. In addition, compared with an existing silicon microphone with a large-size sound inlet hole, the pickup hole of the silicon microphone can effectively prevent external tiny foreign matter from entering the interior of the silicon microphone; meanwhile, due to the fact that the pickup hole is formed in the side wall of the protruding part of the silicon microphone, the effective aperture ratio of the sound inlet hole is increased; the silicon microphone provided by the invention can improve the sound pickup performance of the silicon microphone on the premise of effectively preventing external foreign matters from entering the silicon microphone.

Description

technical field [0001] The invention relates to the fields of acoustics and packaging, in particular to a silicon microphone. Background technique [0002] MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) technology is a high-tech that has developed rapidly in recent years. It uses advanced semiconductor manufacturing technology to realize batch manufacturing of sensors, drivers and other devices. Compared with the corresponding traditional devices , MEMS devices have very obvious advantages in terms of volume, power consumption, weight and price. In the market, the main application examples of MEMS devices include pressure sensors, accelerometers and silicon microphones. [0003] Silicon microphones, also known as MEMS microphones, are microphones based on MEMS technology. Because it has considerable advantages over ECM in terms of miniaturization, performance, reliability, environmental tolerance, cost and mass production capacity, it quickly occup...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R19/00H04R1/08
CPCH04R19/04H04R19/005H04R1/083
Inventor 唐行明梅嘉欣张敏
Owner MEMSENSING MICROSYST SUZHOU CHINA