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mems microphone

A microphone and ASIC chip technology, applied in the field of MEMS microphones, can solve the problems of weak electromagnetic shielding ability of MEMS microphones and anti-blowing ability, and achieve the effect of improving electromagnetic shielding ability

Active Publication Date: 2021-11-26
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the problems referred to above, the object of the present invention is to provide a MEMS microphone to solve problems such as weak electromagnetic shielding ability and anti-blowing ability of existing MEMS microphones.

Method used

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Embodiment Construction

[0030] The present invention provides a new MEMS microphone for the present invention to solve the problem of the current MEMS microphone in the present invention.

[0031] A specific embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0032] In order to illustrate the structure of the MEMS microphone provided by the present invention, figure 1 A MEMS microphone structure is shown in accordance with an embodiment of the present invention.

[0033] like figure 1 As shown, the MEMS microphone provided by the present invention includes a package structure formed by two metal housing and PCB plate 2, and the two metal housing are fixed to both the PCB plate 2, respectively, and form two sound cavities; wherein A sound hole is provided on each of the metal casings, and a MEMS chip 3 is provided on the PCB plate 2 in which the metal casing formed in the acoustical cavity formed in the PCB plate is provided, and a sound hol...

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Abstract

The present invention provides a MEMS microphone, comprising a packaging structure formed by two metal shells and a PCB board, the two metal shells are welded and fixed to the front and back sides of the PCB board respectively, and form two acoustic cavities; wherein, in each Acoustic holes are respectively arranged on the metal casings, MEMS chips are arranged on the PCB board in the acoustic cavity formed by one of the metal casings and the PCB board, and acoustic holes are arranged on the PCB board at positions corresponding to the MEMS chips, Wherein, among the sound holes on the two metal shells and the sound holes on the PCB, at least one sound hole is provided with a damping structure. With the invention, the directivity of the MEMS microphone can be well realized, and at the same time, the problems of weak electromagnetic shielding ability and anti-blowing ability of the existing MEMS microphone can be solved.

Description

Technical field [0001] The present invention relates to the field of electroacoustic conversion techniques, and more particularly to a MEMS microphone. Background technique [0002] MEMS (Micro Electro Mechanical Systems, Micro Electromechanical System) Microphone is a power renapk produced by micromechanical processing techniques, which has a small size, good frequency and low characteristics, low noise. With the cleverness, thin development of electronic devices, MEMS microphones are increasingly widely used on these devices. [0003] The conventional MEMS microphone has a single layer of metal housing structure, and the conventional single-layer housing has a relatively weak problem in practical applications. In addition, the existing MEMS microphone is directly connected to the external connection of the external connection. The airflow directly impinges the diaphragm of the MEMS chip, affecting the anti-blowing capacity of the product, in order to solve the above problems, t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04
CPCH04R19/04H04R2201/003
Inventor 袁兆斌
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD