Anisotropic conductive adhesive film and peeling method of anisotropic conductive adhesive film

Abstract

The invention discloses an anisotropic conductive adhesive film. The anisotropic conductive adhesive film includes a stacked buffer layer and an anisotropic conductive adhesive layer. The buffer layer includes a first surface and a second surface oppositely arranged. , the first surface is used to be directly pasted on the substrate, the second surface is pasted on the anisotropic conductive adhesive layer and completely covers the anisotropic conductive adhesive layer on the second surface Orthographic projection, the buffer layer includes hydrogenated silicon, which is used to generate bubbles to separate the anisotropic conductive adhesive layer from the substrate after being irradiated by laser light, and the anisotropic conductive adhesive layer includes conductive particles for conduction The driving chip and the substrate. The invention also discloses a stripping method of the anisotropic conductive adhesive film. The anisotropic conductive adhesive film is irradiated with laser light to decompose the silicon hydride in the buffer layer to generate hydrogen bubbles to separate the anisotropic conductive adhesive layer and the substrate, so that the anisotropic conductive adhesive film is easy to scrape clean and improve the success rate of rework of defective products.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an anisotropic conductive adhesive film and a peeling method of the anisotropic conductive adhesive film. Background technique [0002] With continuous advancement of display technology, active-matrix organic light emitting diode (AMOLED) displays are more and more widely used. The AMOLED display mainly uses Anisotropic Conductive Film (ACF) to bond Chip On Flex / Chip OnFilm (COF) driver chips on the substrate of the display panel. Due to the low yield rate of the existing COF bonding process, there are more and more cases of rework and rework of defective products. Due to the high cost of COF chips and display panels, it is particularly important to improve the quality of rework. How to design an anisotropic conductive adhesive film that is easy to peel off in the rework process, and how to peel off the cured and bonded anisotropic conductive adhesive film on the substrate with...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a kind of stripping method of anisotropic conductive adhesive film and anisotropic conductive adhesive film, in order to solve the problem that the anisotropic conductive adhesive film is difficult to scrape off in the prior art, if a squeegee stick is used Scratching hard, it is easy to scrape the lines on the substrate, and it cannot be used for rework and rebonding of COF chips

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