Printed circuit board with porous structure resistance layer, and manufacturing method for printed circuit board

A technology of printed circuit board and manufacturing method, which is applied in the directions of printed circuit manufacturing, printed circuit, removal of conductive materials by chemical/electrolytic methods, etc., can solve problems such as poor thermal stability of resistance layer, and achieve good thermal stability and square resistance. Large, productive effects

Inactive Publication Date: 2017-04-19
QUZHOU SUNLORD CIRCUIT BOARD CO LTD
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the resistance layer has the problem of poor thermal stability. After heat treatment at 150°C to 300°C for 30 minutes...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board with porous structure resistance layer, and manufacturing method for printed circuit board
  • Printed circuit board with porous structure resistance layer, and manufacturing method for printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The method for manufacturing a printed circuit board with a porous structure resistance layer includes the following steps: 1. According to the required pattern, paste the first photoresist layer on the conductor layer on the printed circuit board, and perform the first exposure, The first development, the first etching, and the first photoresist; the printed circuit board here is any one of rigid board, flexible board and rigid-flexible board; the insulating medium of the printed circuit board here is Any one of epoxy resin, polytetrafluoroethylene, phenolic resin, polyphenylene ether resin, BT resin, polyimide, liquid crystal polymer, polyester and hydrocarbon-ceramic blend, wherein, here The conductor layer is a copper foil layer, and the conductor layer is arranged inside or outside the printed circuit board.

[0028] 2. Roughening and catalyst adsorption on the surface of the printed circuit board: use chemical methods and / or physical methods to increase the roughn...

Embodiment 2

[0047] 1. After the copper-clad substrate is cleaned and micro-etched with 3% sulfuric acid, hydrogen peroxide-sulfuric acid, a layer of dry film is pressed on the surface, then exposed, developed with 5% sodium carbonate solution, etched with sodium chlorate-copper chloride solution, and finally After being treated with 5% sodium hydroxide solution, the dry film on the surface of the substrate is peeled off, leaving a pre-designed circuit pattern.

[0048] 2. After the action of alkaline potassium permanganate at 85°C, the surface of the circuit board is roughened, forming a microscopically rough and uneven shape.

[0049] 3. The circuit board is continuously subjected to the following treatments to deposit catalyst palladium on its surface:

[0050] Activation - the purpose is to adsorb the colloid composed of palladium and tin on the surface of the circuit board;

[0051] Acceleration - peel off the tin layer on the surface of the palladium colloid to expose the catalytic ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to view more

Abstract

The invention relates to a printed circuit board with a porous structure resistance layer, and a manufacturing method for the printed circuit board. The invention solves a technical problem that a conventional printed circuit board is too small in square resistance. The method comprises the following steps: 1, pasting a first light resistance layer on a conductor layer on the printed circuit board, carrying out the first exposure, first development, first etching and first light resistance removing; 2, carrying out the roughening and catalyst adsorption of the surface of the printed circuit board; 3, pasting a second light resistance layer, carrying out second exposure and second development, and forming a light resistance protection layer in a region where no resistor needs to be deposited, so as to prevent the deposition of a resistor layer; 4, carrying out the deposition of the resistor layer through employing a chemical plating method; 5, removing a protection layer. The method is advantageous in that the resistor of a finished product circuit board manufactured through the method is in a porous structure, is large in square resistance, and is good in thermal stability; moreover, the method is simple, and is high in production efficiency of the circuit board; the adjustment of the value of the resistance of the resistor layer can be achieved through thickness adjustment and porosity adjustment.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing and manufacturing, and in particular relates to a printed circuit board with a porous structure resistance layer and a manufacturing method thereof. Background technique [0002] With the development of the electronic information industry, higher requirements have been put forward for the packaging density and volume quality of electronic information products, and embedding passive devices into printed circuit boards is a very effective solution, and it has naturally become a A hotspot in the development of the printed circuit board industry. Among them, embedding resistors has become the most important product direction. Its advantages are to increase the mounting space on the surface of printed circuit boards. By adopting embedding technology, the reliability of embedded components is better, and by canceling patches and plug-ins The parasitic inductance and capacitance of the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/06H05K3/18
CPCH05K3/06H05K3/184H05K2203/05H05K2203/072
Inventor 石林国白耀文胡斐
Owner QUZHOU SUNLORD CIRCUIT BOARD CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap