Test system of semiconductor laser chip

Abstract

The invention discloses a test system of a semiconductor laser chip. The system comprises a test cabinet, a test power supply, a cooling subsystem, a temperature monitoring subsystem and a computer processing subsystem. The test cabinet comprises a loading platform. A plurality of chip components to be tested are placed on the loading platform. The test power supply is used for providing a test current for the plurality of chip components to be tested. The cooling subsystem is used for providing a circulated cooling liquid for the loading platform so as to provide a stable and reliable temperature for chip component tests. The temperature monitoring subsystem is used for monitoring temperatures of the loading platform and the circulated cooling liquid. The computer processing subsystem is used for making the cooling subsystem provide the circulated cooling liquid possessing the stable and reliable temperature and emitting a corresponding control instruction to the test power supply according to a result monitored by the temperature monitoring subsystem. Through the above mode, test safety can be increased and losses brought by accidental failure of the semiconductor laser chip components are avoided.

Description

technical field [0001] The invention relates to the technical field of testing semiconductor laser chips, in particular to a testing system for semiconductor laser chips. Background technique [0002] With the rapid development of emerging fields such as laser display, laser lighting, 3D printing, and space-ground integrated network, the market for high-power semiconductor lasers is gradually expanding, and the high demand for high-power semiconductor lasers has brought about a huge demand for upstream semiconductor laser chips. , the requirements for output power and reliability of semiconductor laser chips are also increasing. [0003] In order to test effectively, it is necessary to package the semiconductor laser chip on a heat sink with high thermal conductivity, referred to as the semiconductor laser chip component, which is convenient for the subsequent secondary integrated packaging design, such as optical fiber coupling. The common form of chip packaging is COS (Ch...

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Problems solved by technology

[0004] The aging test and long-term life test at a specific current, power, and temperature have very high requirements for the test system. For the aging test, if there is an accidental death of the semiconductor laser chip caused by the test system, it will cause a lot of losses. , and for the long-term life test process, if an accident occurs, the entire life test will be wasted, and the loss is immeasurable

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