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Preparation method of LED (light emitting diode) anti-precipitation glue

An anti-sedimentation and glue technology, applied in grain processing, etc., can solve problems such as phosphor powder settlement, achieve the effects of improving buoyancy, preventing phosphor powder sedimentation, and improving distribution uniformity

Inactive Publication Date: 2017-05-10
HONGLI ZHIHUI GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The diffusing powder is mixed with the glue by stirring. Since the diffusing powder is relatively light, it is difficult to mix it evenly with the glue, so it will eventually cause some phosphors to settle.

Method used

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  • Preparation method of LED (light emitting diode) anti-precipitation glue
  • Preparation method of LED (light emitting diode) anti-precipitation glue

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Embodiment Construction

[0017] The present invention will be further described below in conjunction with the accompanying drawings of the description.

[0018] The invention discloses a preparation method of an anti-precipitation glue for LEDs. After the glue is mixed with a diffusion powder, the anti-precipitation glue is obtained after being ground by a grinder and then output. Such as figure 1 As shown, the grinding machine includes a frame body, three grinding rollers installed on the machine body, a driving mechanism for driving the rotation of the grinding rollers, an adjusting device for adjusting the distance between the grinding rollers, a scraper 5 and a flow guide groove 4 . Described grinding roller comprises the feeding roller 3 that is arranged horizontally, intermediate roller 2 and discharge roller 1, and the diameter of feeding roller 3, intermediate roller 2 and discharging roller 1, length and rotating speed are identical; Described feeding roller 3 , the surface of the intermedia...

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Abstract

The invention relates to a preparation method of an LED (light emitting diode) anti-precipitation glue. The preparation method comprises the following steps of mixing the glue and diffusing powder, grinding by a grinding machine, and outputting, so as to obtain the anti-precipitation glue; (1) preparing a mixture of glue and diffusing powder; (2) adjusting a gap among a charging roll, a intermediate roll and a discharging roll, and enable the charging roll to touch the intermediate roll, and the discharging roll to touch the intermediate roll; (3) adjusting the charging roll, the intermediate roll and the discharging roll to reach the same speed, namely 600 to 1200 revolutions per minute; (4) pouring the mixture glue into a funnel, wherein the mixture is ground by a grinding roll of the grinding machine; (5) attaching the ground mixture glue to the surface of the discharging roll, scraping the mixture glue at the surface of the discharging roll into a flow guide groove, and enabling the ground mixture glue to flow out of the flow guide groove. The preparation method has the advantage that when the glue and the diffusing power are ground by the grinding roll, the diffusing powder is finely ground, and the diffusing powder is diffused in water when the diffusing powder is extruded by two grinding rolls, so that the uniformity of the diffusing powder in the glue is further improved.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to a method for preparing an anti-precipitation glue for LEDs. Background technique [0002] The fluorescent glue used in LED generally refers to the mixture of glue and phosphor. Phosphor powder is used to form white light after being excited by the light emitted by the LED chip, that is to say, the distribution of phosphor powder in the glue directly affects the light output effect of the LED. The traditional method of preparing fluorescent glue is to mix a certain proportion of fluorescent powder into the glue, and then stir the mixture glue, so that the fluorescent powder can be evenly distributed in the glue, and the fluorescent glue is obtained. Since the phosphor is in the form of fixed particles and the glue is in a fluid state, under the action of gravity, the phosphor particles will settle in the glue, causing the distribution of the phosphor in the glue to become uneven. In severe ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B02C4/04B02C4/40B02C4/32
CPCB02C4/04B02C4/32B02C4/40
Inventor 钟云付翔黄军刘勇王跃飞
Owner HONGLI ZHIHUI GRP CO LTD