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Laser cutting small hole process

A laser cutting and laser cutting machine technology, applied in laser welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of reducing the application range of laser cutting machines, laser cutting cannot be realized, etc., to improve the efficiency and improve the application range. Effect

Inactive Publication Date: 2017-05-10
四川荷斐斯通用设备制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Because laser cutting has many advantages, it is widely used. In the cutting process of existing laser cutting machines, when the diameter of the opening is less than 2.5 times the thickness of the metal wall, laser cutting cannot be achieved, such as metal When the thickness of the board wall is 5mm, the diameter of the laser opening must not be less than 12.5mm, resulting in the inability of the laser cutting equipment to exert its maximum effect and reducing the application range of the laser cutting machine

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  • Laser cutting small hole process
  • Laser cutting small hole process

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Embodiment 1

[0038] Such as figure 1 and figure 2 As shown, in this embodiment, a carbon steel plate with a wall thickness of 5 mm is used as an example to laser cut a small hole with a diameter of 2 mm.

[0039] A kind of laser cutting small hole technology of the present embodiment, comprises the following steps:

[0040] Step 1. Positioning the metal plate 3, placing the metal plate 3 with small holes to be cut on the processing platform, and clamping and positioning;

[0041] Step 2. Set the laser motion trajectory matching the contour of the small hole 2;

[0042] Step 3. Set the process parameters of the laser cutting machine, the power is 1500W, and the pulse frequency is 60HZ;

[0043] Step 4. Cutting and forming. The laser cutting machine combines the auxiliary gas to perforate and complete the cutting according to the movement track.

[0044] In this embodiment, in step 1, the wall thickness of the metal plate 3 is 5 mm, and the diameter of the small hole 2 is 2 mm.

[0045...

Embodiment 2

[0053] Such as figure 1 and figure 2 As shown, this embodiment takes stainless steel with a wall thickness of 8 mm, and a small hole with a diameter of 3 mm laser cut as an example.

[0054] A kind of laser cutting small hole technology of the present embodiment, comprises the following steps:

[0055] Step 1. Positioning the metal plate 3, placing the metal plate 3 with small holes to be cut on the processing platform, and clamping and positioning;

[0056] Step 2. Set the laser motion trajectory matching the contour of the small hole 2;

[0057] Step 3. Set the process parameters of the laser cutting machine, the power is 1800W, and the pulse frequency is 75HZ;

[0058] Step 4. Cutting and forming. The laser cutting machine combines the auxiliary gas to perforate and complete the cutting according to the movement track.

[0059] In this embodiment, in step 1, the thickness of the metal plate wall 3 is 8 mm, and the diameter of the small hole 2 is 3 mm.

[0060] In this...

Embodiment 3

[0069] Such as figure 1 and figure 2 As shown, in this embodiment, an aluminum plate with a wall thickness of 12 mm is used as an example to laser cut a small hole with a diameter of 4 mm.

[0070] A kind of laser cutting small hole technology of the present embodiment, comprises the following steps:

[0071] Step 1. Positioning the metal plate 3, placing the metal plate 3 with small holes to be cut on the processing platform, and clamping and positioning;

[0072] Step 2. Set the laser motion trajectory matching the contour of the small hole 2;

[0073] Step 3. Set the process parameters of the laser cutting machine, the power is 2200W, and the pulse frequency is 100HZ;

[0074] Step 4. Cutting and forming. The laser cutting machine combines the auxiliary gas to perforate and complete the cutting according to the movement track.

[0075] In this embodiment, in step 1, the wall thickness of the metal plate 3 is 12 mm, and the diameter of the small hole 2 is 4 mm.

[0076...

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Abstract

The invention discloses a laser cutting process, particularly a laser cutting small hole process, and belongs to the technical field of laser cutting. The process comprises the following steps that: step 1, a metal plate is positioned, the metal plate to be cut with small holes is placed on process platform, clamped tightly and positioned; step 2, a laser movement track that matches the small hole contour is set; step 3, process parameters for laser cutting machine is set, power is 1500W-2500W, and pulse frequency is 60HZ-120HZ; step 4, cutting and molding are completed, the laser cutting machine combining auxiliary gas bores holes and completes cutting according to the movement track. The laser cutting small hole process can process small holes with diameter smaller than the thickness of the metal plate, the minimum diameter can reach 0.4 times the thickness of the metal plate, and thus the efficiency of the laser cutting machine is improved, and the application range of the laser cutting machine is extended.

Description

technical field [0001] The invention relates to a laser cutting process, in particular to a laser cutting small hole process, which belongs to the technical field of laser cutting. Background technique [0002] Laser cutting is the use of high-power-density laser beams to irradiate the material to be cut, so that the material is quickly heated to the vaporization temperature, and evaporates to form holes. As the beam moves to the material, the holes continuously form narrow slits to complete the cutting of the material. cutting. [0003] Due to the small laser spot, high energy density and fast cutting speed, laser cutting can obtain better cutting quality. [0004] The laser cutting slit is narrow, the two sides of the slit are parallel and perpendicular to the surface, and the dimensional accuracy of the cut parts can reach ±0.05mm. [0005] The cutting surface is smooth and beautiful, and the surface roughness is only tens of microns. Even laser cutting can be used as t...

Claims

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Application Information

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IPC IPC(8): B23K26/382B23K26/14
CPCB23K26/382B23K26/14
Inventor 程丰
Owner 四川荷斐斯通用设备制造有限公司