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Correction method for grinding configuration information and wafer grinding system

A correction method and technology for configuring information, applied in grinding devices, grinding machine tools, metal processing equipment, etc., can solve problems such as the impact of wafer grinding system productivity, wafer reduction, etc., to avoid downtime to replace grinding heads and reduce wafers Failure, the effect of improving productivity

Inactive Publication Date: 2017-05-10
WUHAN XINXIN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Doing so will reduce the number of qualified wafers and have a greater impact on the productivity of the wafer grinding system

Method used

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  • Correction method for grinding configuration information and wafer grinding system

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Embodiment Construction

[0020] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0021] In a preferred embodiment, as figure 1 As shown, a correction method for grinding configuration information is proposed, which is applied to wafer grinding systems. Each wafer grinding system includes a group of grinding heads, and the number of grinding heads in a group of grinding heads is multiple. The wafer grinding system It also includes a plurality of storage units, and the grinding configuration information of each grinding head is stored in the corresponding storage unit; the correction method may include:

[0022] Step S1, controlling the work of the corresponding grinding head according to the grinding configuration information in each storage unit;

[0023] Step S2, monitor the working condition of each grinding head by group;

[0024] Step S3, according to the monitoring situation, find out the problematic grinding head in a group ...

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Abstract

The invention relates to the technical field of semiconductors, in particular to a correction method for grinding configuration information. The correction method comprises the steps that 1, work of corresponding grinding heads is controlled according to the grinding configuration information in all storage units; 2, the working conditions of all the grinding heads are monitored by group; 3, the grinding head having problems in a group of grinding heads is found out according to the monitoring conditions; 4, the grinding configuration information in the storage unit corresponding to the grinding head having the problems is corrected. The invention further provides a wafer grinding system applying the correction method. According to the technical scheme, the grinding configuration information of the grinding head having the problems can be corrected independently, the trouble of replacing the grinding head by stopping a machine is omitted, the wafer failure condition is reduced, and then the capacity of the wafer grinding system is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for correcting grinding configuration information and a wafer grinding system. Background technique [0002] In the existing wafer grinding system, each wafer grinding system includes a grinding head, and multiple grinding heads form a group of grinding heads. When each group of grinding heads works to generate a set of grinding data, there will often be one or more Due to the different surface morphology of the grinding head, the corresponding grinding data obviously deviates from the normal value. The existing practice is to judge the wafer polished by the problematic grinding head as invalid when there is a problem with one grinding head. When there is a problem with multiple grinding heads, it is necessary to stop the machine and replace the problematic grinding head. Doing so will reduce the number of qualified wafers and have a greater impact on the product...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/005
CPCB24B37/005
Inventor 杨一凡
Owner WUHAN XINXIN SEMICON MFG CO LTD