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A kind of preparation method of high permittivity metallized surface plate

A metallized surface, high permittivity technology, applied in chemical instruments and methods, metal layered products, synthetic resin layered products, etc., can solve the problems of low permittivity and cumbersomeness of PTFE copper clad laminates, and achieve good bending strength. , The effect of excellent comprehensive performance and high permittivity

Active Publication Date: 2018-09-28
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is cumbersome, and the PTFE copper clad laminate has a very low permittivity (2.64 at 1GHz), and the maximum transverse bending strength is only 91MPa

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Preparation of rutile phase TiO 2 Particles, prepare epoxy resin, silane coupling agent KH560, cut polytetrafluoroethylene fabric and glass fiber fabric into strips, the aspect ratio is 2, and contain TiO 2 Three-dimensional interpenetrating bonding is performed in a slurry of oxide particles. Measure 90ml of ethanol, 10ml of distilled water, 5ml of heptanoic acid, and 10ml of silane coupling agent KH560 to prepare a mixed solution. Soak the three-dimensionally interspersed and bonded polytetrafluoroethylene fabric and glass fiber fabric with this solution for 10 hours, and then put them in an oven at 60°C for 2 hours, and the rutile phase TiO 2 The oxide particles and epoxy resin are mixed evenly and vacuumized to obtain a mixed slurry, and then the dried PTFE fabric and glass fiber fabric are impregnated with the mixed slurry; the rutile phase TiO 2 The polytetrafluoroethylene fabric and glass fiber fabric of oxide particles and epoxy resin are combined in a space-i...

Embodiment 2

[0022] Preparation of rutile phase TiO 2 Oxide particles, prepare cyclic organic compounds containing C, H, O, silane coupling agent KH560, cut the glass fiber fabric into strips with an aspect ratio of 2, and cut the polytetrafluoroethylene fabric into strips with a length and width ratio of 20, and in TiO-containing 2 Three-dimensional interpenetrating bonding is performed in a slurry of oxide particles. Take 90ml of ethanol, 10ml of distilled water, 5ml of heptanoic acid, and 10ml of KH560 to prepare a mixed solution. Use the solution to soak the glass fiber fabric and strip PTFE fabric for 10 hours, and then put them in an oven at 60°C for 2 hours. Rutile phase TiO 2 The oxide particles and the epoxy resin are uniformly mixed and vacuumized to obtain a mixed slurry, and then the strip-shaped polytetrafluoroethylene fabric and glass fiber fabric are impregnated with the mixed slurry. sticky with TiO 2 The strip-shaped PTFE fabric and glass fiber fabric of oxide particles...

Embodiment 3

[0024] The volume content of each component: 30% of rutile phase titanium dioxide particles, 50% of epoxy resin, 9% of polytetrafluoroethylene fabric, 6% of glass fiber fabric, 5% of coupling agent, and the rest are the same as in Example 1.

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Abstract

The invention discloses a method for preparing a metallized-surface sheet material with high permittivity and relates to substrate materials for printed circuit boards. The method comprises the steps: shearing organic fabrics into strips, then, placing the organic fabric strips in slurry of rutile-phase titanium dioxide granules, and carrying out three-dimensional interpenetrated bonding; preparing an enanthic acid solution, and dissolving a couplant in the enanthic acid solution, so as to obtain a solution A; soaking the three-dimensional interpenetrated bonded organic fabrics in the solution A, and carrying out drying, so as to obtain dried organic fabrics; mixing rutile-phase titanium dioxide granules or rutile-phase titanium dioxide fibers with a C, H and O containing cyclic organic matter, carrying out vacuumizing so as to obtain size mixture, then, soaking the dried organic fabrics in the size mixture, carrying out spatial interpenetrated bonding, and carrying out baking, so as to obtain a prepreg; and covering the upper and lower surfaces of the prepreg with copper foils, then, carrying out heating and pressurizing, and carrying out cooling, thereby obtaining the metallized-surface sheet material; or carrying out heating and pressurizing on the prepreg, carrying out cooling, and then, carrying out a chemical reaction and physical-electric-field metallized-layer thickening sequentially, thereby obtaining the metallized-surface sheet material.

Description

technical field [0001] The invention relates to substrate materials for printed circuit boards, in particular to a method for preparing high permittivity metallized surface boards. Background technique [0002] Metallized surface plates are widely used in satellite communication systems, microstrip antennas and car navigation systems. With the continuous upgrading of electronic products and the trend of miniaturization, higher requirements are put forward for metallized surface plates. Smaller, better overall performance. In order to achieve the purpose of reducing the size of the equipment and improving the overall performance, the metallized surface plate must have a high permittivity, low dielectric loss, good bending strength and peel strength, etc. In the Chinese patent (CN 102794951A low-loss polymer-oxide layered bonding material used in the microwave field), Li Lei et al. used the polymer material polytetrafluoroethylene and Ba with a dielectric constant of 76 1.85...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/06B32B37/08B32B37/10B32B27/02B32B17/02B32B15/085B32B15/14B32B15/20B32B15/04B32B27/32C08L63/00C08L27/18C08K9/06C08K9/04C08K7/14C08K3/22
CPCB32B5/02B32B15/085B32B15/14B32B15/20B32B37/06B32B37/08B32B37/10B32B2260/021B32B2262/0253B32B2262/101C08K2201/014C08L63/00C08L2205/16C08L27/18C08K9/06C08K9/04C08K7/14C08K2003/2241
Inventor 熊兆贤管仁刚冯瑶
Owner XIAMEN UNIV