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Method for preparing metallized-surface sheet material with high permittivity

A metallized surface, high permittivity technology, used in chemical instruments and methods, metal layered products, lamination, etc., can solve the problems of cumbersome, low permittivity of PTFE copper clad laminates, and achieve excellent comprehensive performance and bending strength. Good, high permittivity effect

Active Publication Date: 2017-05-10
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is cumbersome, and the PTFE copper clad laminate has a very low permittivity (2.64 at 1GHz), and the maximum transverse bending strength is only 91MPa

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Preparation of rutile TiO 2 Particles, prepare epoxy resin, silane coupling agent KH560, cut the PTFE fabric and glass fiber fabric into strips with a length-to-width ratio of 2, and contain TiO 2 Three-dimensional interspersed bonding is performed in the slurry of oxide particles. Measure 90ml of ethanol, 10ml of distilled water, 5ml of heptanoic acid, and 10ml of silane coupling agent KH560 to prepare a mixed solution. Use the solution to soak the three-dimensional interspersed PTFE fabric and glass fiber fabric for 10 hours, and then put it in an oven at 60°C for 2 hours. 2 Oxide particles and epoxy resin are evenly mixed and vacuumed to obtain a mixed slurry, and then the dried PTFE fabric and glass fiber fabric are impregnated with the mixed slurry; rutile TiO is adhered 2 The PTFE fabric and glass fiber fabric of oxide particles and epoxy resin are combined in space interspersed fabric according to PTFE fabric / glass fiber fabric / glass fiber fabric / PTFE fabric, and th...

Embodiment 2

[0022] Preparation of rutile TiO 2 Oxide particles, prepare cyclic organics containing C, H, O, silane coupling agent KH560, cut glass fiber fabric into strips with a length-to-width ratio of 2, and cut polytetrafluoroethylene fabric into strips with a length and width Ratio is 20, and contains TiO 2 Three-dimensional interspersed bonding is performed in the slurry of oxide particles. Measure 90ml of ethanol, 10ml of distilled water, 5ml of heptanoic acid, 10ml of KH560, respectively, to prepare a mixed solution, soak the glass fiber fabric and the strip PTFE fabric with the solution for 10h, and then put it in an oven at 60℃ for 2h, rutile TiO 2 The oxide particles and epoxy resin are uniformly mixed and vacuumed to obtain a mixed slurry, and then the strip-shaped polytetrafluoroethylene fabric and glass fiber fabric are impregnated with the mixed slurry. With TiO 2 The strip-shaped PTFE fabric and glass fiber fabric of oxide particles and epoxy resin are combined in space inte...

Embodiment 3

[0024] The volume content of each component: 30% of rutile phase titanium dioxide particles, 50% of epoxy resin, 9% of polytetrafluoroethylene fabric, 6% of glass fiber fabric, 5% of coupling agent, and the rest are the same as in Example 1.

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Abstract

The invention discloses a method for preparing a metallized-surface sheet material with high permittivity and relates to substrate materials for printed circuit boards. The method comprises the steps: shearing organic fabrics into strips, then, placing the organic fabric strips in slurry of rutile-phase titanium dioxide granules, and carrying out three-dimensional interpenetrated bonding; preparing an enanthic acid solution, and dissolving a couplant in the enanthic acid solution, so as to obtain a solution A; soaking the three-dimensional interpenetrated bonded organic fabrics in the solution A, and carrying out drying, so as to obtain dried organic fabrics; mixing rutile-phase titanium dioxide granules or rutile-phase titanium dioxide fibers with a C, H and O containing cyclic organic matter, carrying out vacuumizing so as to obtain size mixture, then, soaking the dried organic fabrics in the size mixture, carrying out spatial interpenetrated bonding, and carrying out baking, so as to obtain a prepreg; and covering the upper and lower surfaces of the prepreg with copper foils, then, carrying out heating and pressurizing, and carrying out cooling, thereby obtaining the metallized-surface sheet material; or carrying out heating and pressurizing on the prepreg, carrying out cooling, and then, carrying out a chemical reaction and physical-electric-field metallized-layer thickening sequentially, thereby obtaining the metallized-surface sheet material.

Description

Technical field [0001] The invention relates to a substrate material for printed circuit boards, in particular to a method for preparing a metalized surface plate with a high permittivity. Background technique [0002] Metalized surface plates are widely used in satellite communication systems, microstrip antennas and car navigation systems. With the continuous upgrading of electronic products and the trend toward miniaturization, higher requirements are placed on metalized surface plates. Smaller, better overall performance. In order to achieve the goal of reducing the size of the equipment and having better overall performance, the metalized surface plate must have a higher permittivity, lower dielectric loss, good bending strength and peel strength. In the Chinese patent (CN 102794951A low-loss polymer-oxide layered bonding material used in the microwave field), Li Lei used the polymer material polytetrafluoroethylene and Ba with a dielectric constant of 76 1.85 Sm 4.1 Ti 9 O...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/06B32B37/08B32B37/10B32B27/02B32B17/02B32B15/085B32B15/14B32B15/20B32B15/04B32B27/32C08L63/00C08L27/18C08K9/06C08K9/04C08K7/14C08K3/22
CPCB32B5/02B32B15/085B32B15/14B32B15/20B32B37/06B32B37/08B32B37/10B32B2260/021B32B2262/0253B32B2262/101C08K2201/014C08L63/00C08L2205/16C08L27/18C08K9/06C08K9/04C08K7/14C08K2003/2241
Inventor 熊兆贤管仁刚冯瑶
Owner XIAMEN UNIV