Indirect equivalent measurement method for assembling clearance

Abstract

The invention discloses an indirect equivalent measurement method for an assembling clearance, which comprises the steps of designing and manufacturing a straight rule mold, a folding rule mold and a rod-like mold; selecting the straight rule mold, the folding rule mold or the rod-like mold according to the assembling clearance of different components of a PCB; and performing measurement on the electrical safety assembling clearance of the PCB by using the selected straight rule mold, the folding rule mold or the rod-like mold. According to the invention, a measuring mold is designed and manufactured, a measurement requirement is converted into a mold constant value, an effect of static measurement is achieved, and a problem that a traditional measurement method cannot realize small-space measurement is solved; indirect equivalent measurement for the safety clearance is realized through selecting the appropriate measuring mold, and a problem that the traditional measurement method is not accurate enough is solved; and the measurement period is shortened through performing measurement by using the appropriate measuring mold, and a defect of low efficiency of the traditional measurement method is made up.

Description

technical field [0001] The invention relates to an indirect equivalent measurement method for an assembly gap, which is especially suitable for the electrical safety assembly gap of related components of a PCB board, and belongs to the technical field of component assembly gap measurement. Background technique [0002] In aerospace products, there are more and more structural parts involving PCB boards. In order to make the design safety performance of PCB boards reach the target, there must be electrical clearances in each part, that is, the minimum linear distance between exposed charged conductors. However, in the actual design and production process In the process, because the design and control are not in place, the short circuit phenomenon occurs from time to time. This requires technicians to strictly control the safety clearance of each component in the early design process, and accurately measure the safety clearance in the later production process, and make timely ...

AI Technical Summary

Problems solved by technology

[0008] The technical problem solved by the present invention is: to overcome the deficiencies of the prior art, the present invention provides an indirect equivalent measurement method for the assembly gap, by designing and manufacturing a measuring mold, the measurement requirement is converted into a fixed value of the mold, and the static The effect of the measurement solves the problem that the traditional measurement method cannot achieve small space measurement; by selecting the appropriate measurement mold, the indirect equivalent measurement safety gap is realized, which overcomes the problem that the traditional measurement method is not accurate enough; by using the appropriate measurement mold measurement, which shortens the measurement cycle and makes up for the low efficiency of traditional measurement methods

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