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On-board direct current voltage reduction chip failure analysis method

A technology of DC voltage reduction and failure analysis, applied in the field of vehicle, can solve problems such as failure location and uneconomical efficiency, and achieve the effect of high speed

Inactive Publication Date: 2017-05-10
苏州华碧微科检测技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chip testing requires dedicated chip testing equipment and supporting test circuits, and it cannot use EMMI to locate failures in its working state, so it is uneconomical and inefficient

Method used

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  • On-board direct current voltage reduction chip failure analysis method
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  • On-board direct current voltage reduction chip failure analysis method

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0024] refer to figure 1 As shown, a failure analysis method for a vehicle-mounted DC step-down chip includes the following steps:

[0025] Step 1) Appearance inspection, by observing the appearance of the circuit board, to see whether there is obvious damage on the outside, to determine whether the circuit board itself has any problems that affect the use, and there is no external damage in this embodiment, record;

[0026] Step 2) Comparative analysis of the I / V...

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Abstract

The invention discloses an on-board direct current voltage reduction chip failure analysis method. The on-board direct current voltage reduction chip failure analysis method comprises a step 1, appearance inspection; a step 2, qualified product and unqualified product I / V test comparison analysis; a step3, nondestructive examination comparison analysis; a step 4, unpackaging and internal inspection; a step 5, EMMI comparison analysis; a step 6, record summarizing, and on-board direct current voltage reduction chip failure position locating. The on-board direct current voltage reduction chip failure analysis method is convenient and effective, and is advantageous in that the chip failure positions are located quickly, and failure stress source is analyzed accurately.

Description

technical field [0001] The invention relates to the vehicle field, in particular to a failure analysis method for a vehicle DC step-down chip. Background technique [0002] In view of the chip failure of electronic products after leaving the factory, there is no mature and effective analysis method to analyze the cause and location of chip failure. Chip testing requires dedicated chip testing equipment and supporting testing circuits, and it cannot use EMMI to locate failures in its working state, so it is uneconomical and inefficient. Contents of the invention [0003] The purpose of the present invention is to overcome the above problems existing in the prior art and provide a failure analysis method for a vehicle-mounted DC step-down chip. The present invention is a convenient and efficient analysis method that can quickly locate the failure location of the chip and accurately analyze the failure source of stress. [0004] In order to achieve the above-mentioned techn...

Claims

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Application Information

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IPC IPC(8): G01R31/28
CPCG01R31/2856
Inventor 李红高
Owner 苏州华碧微科检测技术有限公司
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