A kind of pcb board exposure method and device

Abstract

The invention discloses a PCB (Printed Circuit Board) exposure method and device. The PCB exposure method comprises the following steps: S1: manufacturing text data related to stretching and translation needed by a delivery unit, and writing the text data into a DI (Direct Imager) exposure machine, wherein the text data comprises a plurality of expansion and shrinking coefficient grouping intervals and a plurality of expansion and shrinking coefficient sets, the expansion and shrinking coefficient grouping intervals correspond to the expansion and shrinking coefficient sets one by one, each expansion and shrinking coefficient set comprises ODF (Optical Distribution Frame) coefficients of a Panel edge frame, a delivery unit and a green oil target, and the ODF coefficients are expansion and shrinking coefficients; S2: measuring through the DI exposure machine to obtain the actual size of a PCB; calculating a difference value of the actual size of the PCB and a standard size; S3: selecting the expansion and shrinking coefficient sets in the corresponding text data by the DI exposure machine according to the difference value, and carrying out translation and stretching on the delivery unit according to the selected expansion and shrinking coefficient sets. According to the PCB exposure method and device, a finished product SET meets requirements of customers and outer-layer image deviation and exposure rejection problems can be effectively improved, so that an outer-layer exposure alignment capability is improved.

Description

technical field [0001] The invention relates to the field of circuit board exposure, in particular to a PCB board exposure method and device. Background technique [0002] Due to the different expansion and shrinkage of different PCB boards, in order to meet the customer's SET finished product size requirements (optical point to optical point tolerance + / -2mil), the outer layer exposure cannot use the automatic stretching method, and must use a fixed SET ratio of translation + stretching Tool production. This production process can be simplified as follows: manual selection of tool coefficients (i.e. exposure data tool) → DI machine measuring target hole distance → DI machine judgment matching → DI machine exposure. At present, due to the manual selection of tool coefficients in the DI exposure production process method of the outer layer, the tool coefficient (ie, the exposure data tool) will not match the actual expansion and contraction coefficient of the PBC board, whic...

AI Technical Summary

Problems solved by technology

At present, due to the manual selection of tool coefficients in the DI exposure production process method of the outer layer, the tool coefficient (ie, the exposure data tool) will not match the actual expansion and contraction coefficient of the PBC board, which will lead to graphic deviation (graphic collapse blind hole) or Deny exposure

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