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Position adjusting method of wafer protection module of photoetching machine and photoetching machine

A technology for protecting modules and adjusting methods, which is applied in microlithography exposure equipment, optomechanical equipment, photolithographic process exposure devices, etc., can solve problems such as poor mechanical positioning stability, inability to find in time, product rework, etc., and achieve improved accuracy. Effect

Active Publication Date: 2017-05-31
NANTONG TONGFU MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing wafer protection modules are realized by a metal protection ring jig, and installed on the exposure platform of the lithography machine through mechanical positioning. Due to the poor stability of the mechanical positioning, and the deviation cannot be found in time, it will lead to large Batches of products are reworked or even scrapped, causing serious economic quality loss

Method used

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  • Position adjusting method of wafer protection module of photoetching machine and photoetching machine
  • Position adjusting method of wafer protection module of photoetching machine and photoetching machine
  • Position adjusting method of wafer protection module of photoetching machine and photoetching machine

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Embodiment Construction

[0021] see figure 1 , figure 1 It is a schematic flowchart of an embodiment of a method for adjusting the position of a wafer protection module of a lithography machine according to the present invention, and the method includes the following steps:

[0022] S101: placing the wafer protection module on the surface of the base;

[0023] Specifically, in a practical application process, the wafer protection module usually requires an external fixing device or through vacuum, magnetic adsorption, etc., to fix the wafer protection module at a certain position relative to the base.

[0024] S102: Detect and calculate the offset between the actual position and the theoretical position of the wafer protection module according to the preset reference marks on the surface of the base;

[0025] Specifically, the reference mark on the surface of the abutment can be artificially added later, or it can be a positioning hole or a characteristic pattern on the surface of the abutment when ...

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Abstract

The invention discloses a position adjusting method of a wafer protection module of a photoetching machine and the photoetching machine. The method comprises the steps of putting the wafer protection module on the surface of a base station; detecting a preset reference mark on the surface of the base station and calculating the offset between an actual position and a theoretical position of the wafer protection module; judging whether the offset is greater than a preset threshold or not; and if so, adjusting the relative position of the base station of the wafer protection module according to the offset, so that the adjusted offset is smaller than the preset threshold. According to the position adjusting method of the wafer protection module, the position accuracy of the wafer protection module can be improved.

Description

technical field [0001] The invention relates to the field of semiconductor lithography, in particular to a method for adjusting the position of a wafer protection module of a lithography machine and the lithography machine. Background technique [0002] Lithography machines are key equipment in the field of semiconductor manufacturing, and generally use wafer modules. The existing wafer protection modules are realized by a metal protection ring jig, and installed on the exposure platform of the lithography machine through mechanical positioning. Due to the poor stability of the mechanical positioning, and the deviation cannot be found in time, it will lead to large Batches of products are reworked or even scrapped, causing serious economic and quality losses. Contents of the invention [0003] The technical problem mainly solved by the present invention is to provide a method for adjusting the position of a wafer protection module of a lithography machine and a lithograph...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G03F9/00
CPCG03F7/70691G03F7/70775G03F7/7085G03F9/7088
Inventor 吴谦国
Owner NANTONG TONGFU MICROELECTRONICS CO LTD