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Deposition device and deposition method

A deposition device and substrate technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems of reduced deposition accuracy and distortion of thin film patterns, and achieve the effect of improving accuracy and reducing sagging

Active Publication Date: 2022-04-05
SAMSUNG DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This misalignment results in reduced deposition accuracy and thus can cause distortions in the pattern of the thin film formed by depositing the deposition species on the substrate

Method used

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  • Deposition device and deposition method
  • Deposition device and deposition method
  • Deposition device and deposition method

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Embodiment Construction

[0048] Advantages and features of the present invention and methods for achieving the advantages and features will be clarified with reference to the embodiments described in detail below with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be realized in various forms different from each other. These embodiments are provided only to make the disclosure of the present invention complete and to fully inform those skilled in the art to which the present invention pertains, and the present invention is defined only by the scope of the claims.

[0049] When an element or layer is referred to as being "on" another element or layer, the element or layer is directly on the other element or layer or with the other layer or other element interposed therebetween. The same reference numerals denote the same constituent elements throughout the specification.

[0050] It should be clear that although first, ...

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Abstract

Provided are a deposition device and a deposition method. As an example, the deposition apparatus includes: a plurality of substrate supporting parts supporting both ends of the substrate and configured to be able to move up and down; a plurality of substrate clamping parts arranged overlapping the both ends of the substrate above each of the plurality of substrate supporting parts and configured to be able to move up and down; a plurality of stretching blocks arranged between the respective substrate supporting parts and the respective substrate holding parts , and the plurality of stretching blocks move horizontally away from each other to stretch the substrate when the respective substrate clamping parts move downward; and a plurality of push rods are arranged on the The stretching blocks are moved horizontally within each stretching block and away from each other by a descending movement.

Description

technical field [0001] The invention relates to a deposition device and a deposition method. Background technique [0002] Liquid crystal display devices, plasma display devices, organic light emitting display devices, and the like are widely used as display devices. [0003] Such a display device can be manufactured by depositing a deposition substance on a substrate by a deposition process to form a thin film. [0004] To form a thin film on a substrate, the end of the substrate is supported to expose the deposition face of the substrate during the deposition process. However, since the substrate is upsized as the display device is upsized, severe sagging occurs in the central portion of the substrate. In this case, errors may occur during the alignment of the substrate and the mask. Such misalignment results in reduced deposition accuracy and thus may cause distortion in the pattern of the thin film formed by depositing the deposition substance on the substrate. Cont...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/687H01L21/02
CPCH01L21/02104H01L21/6831H01L21/687
Inventor 李炳哲金盛来西口昌男车裕敏郑成镐
Owner SAMSUNG DISPLAY CO LTD