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Liquid treatment method for substrates, liquid treatment device for substrates, and computer-readable storage medium for storing liquid treatment program for substrates

A technology for liquid treatment and liquid treatment, which is applied in the field of computer-readable storage media, and can solve problems such as inability to remove impurities

Active Publication Date: 2017-05-31
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even if a pure water cleaning solution is supplied to the hydrophobically treated substrate, impurities remaining on the surface of the substrate cannot be removed.

Method used

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  • Liquid treatment method for substrates, liquid treatment device for substrates, and computer-readable storage medium for storing liquid treatment program for substrates
  • Liquid treatment method for substrates, liquid treatment device for substrates, and computer-readable storage medium for storing liquid treatment program for substrates
  • Liquid treatment method for substrates, liquid treatment device for substrates, and computer-readable storage medium for storing liquid treatment program for substrates

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Embodiment Construction

[0031] Next, specific embodiments of the substrate liquid processing apparatus and the substrate liquid processing method according to the present invention will be described with reference to the drawings.

[0032] Such as figure 1 As shown, the substrate liquid processing apparatus 1 has an input / output unit 2 at the front end. A carrier 4 accommodating a plurality of (for example, 25) substrates 3 (semiconductor wafers here) is input and output to the input and output unit 2, and the carriers 4 are placed on the input and output unit in a manner of being aligned in the left-right direction. 2.

[0033] In addition, the substrate liquid processing apparatus 1 has a transport unit 5 at the rear of the input and output unit 2 . A substrate transfer device 6 is arranged on the front side of the transfer unit 5 , and a substrate transfer table 7 is arranged on the rear side of the transfer unit 5 . In this transfer unit 5 , the substrate transfer device 6 is used to transfer ...

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PUM

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Abstract

This substrate treatment method involves performing: a liquid treatment step for liquid-treating a substrate with a treatment liquid; a rinse treatment step for rinsing the liquid-treated substrate with a rinsing liquid; a water-repellency treatment step for subjecting the rinsed substrate to a water-repellency treatment using a water-repellency-imparting solution; next, a cleaning treatment step for cleaning the substrate subjected to the water-repellency treatment by using functional water; thereafter, an alcohol treatment step for contacting alcohol and the cleaned substrate with one another; and thereafter, a drying treatment step for drying the substrate. Furthermore, the cleaning treatment step makes it possible to remove impurities remaining on the surface of the substrate subjected to the water-repellency treatment.

Description

technical field [0001] The present invention relates to a substrate liquid processing method, a substrate liquid processing device, and a computer-readable storage medium storing a substrate liquid processing program by using a hydrophobizing liquid to hydrophobize the surface of a liquid-treated substrate and then drying the surface of the substrate . Background technique [0002] Conventionally, in the manufacture of semiconductor devices, flat panel displays, etc., substrates such as semiconductor wafers and liquid crystal substrates have been subjected to liquid processing using various processing liquids using substrate liquid processing equipment, and then the residues on the substrates have been removed by rotating the substrates at high speeds. The drying treatment of the treatment liquid. [0003] In this substrate liquid processing apparatus, the following phenomenon may occur due to miniaturization and high aspect ratio of patterns such as circuit patterns and et...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304
CPCB08B3/04H01L21/67051H01L21/02052H01L21/6715B08B3/00H01L21/304H01L21/67265H01L21/68742
Inventor 中森光则野中纯
Owner TOKYO ELECTRON LTD