Pre-encapsulated multi-lateral side immerseable lead frame structure and manufacturing method of lead frame structure

Abstract

The invention relates to a pre-encapsulated multi-lateral side immerseable lead frame structure and a manufacturing method of the lead frame structure. The structure comprises a first metal layer (1), a base island (2) and pins (3) are arranged on a front surface of the first metal layer (1), the peripheries of the first metal layer (1), the base island (2) and the pins (3) are filled with a pre-encapsulated insulation material (4), a front surface of the pre-encapsulated insulation material (4) is flush with front surfaces of the base island (2) and the pins (3), a back surface of the pre-encapsulated insulation material (4) is flush with a back surface of the first metal layer (1), and grooves (5) are formed in peripheral edge parts of the front surfaces of the pins (3). The immerseable lead frame structure is fabricated by a pre-encapsulating method, and has higher immerseable area, higher binding force, excellent tin climbing capability and winding capability, meanwhile, single test can be performance, the performance can be easily and rapidly tested during the package process, so that chip waste is reduced, and the test cost is substantially reduced.

Description

technical field [0001] The invention relates to a pre-encapsulated multi-side wettable lead frame structure and a manufacturing method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] Semiconductor packaging technology includes many packaging forms. Recently, with the miniaturization of electronic products and the increasing demand for input / output (input / output, I / O), the quadrilateral flat no-lead package belonging to the quadrilateral flat package series has a shorter Signal transmission path and relatively fast signal transmission speed, so it is suitable for high-frequency transmission chip packaging. [0003] The package unit of the quad flat no-lead (QFN) package is cut by a blade, so the sides of the pins are exposed, and then a metal layer is formed on the exposed pins so that the solder is easily adsorbed on the sides of the package unit, To facilitate inspection of solder joints when the formed package unit is mo...

AI Technical Summary

Problems solved by technology

However, this structure has complicated process and many processes, which increases the production cost, and although the extension part is added, the tin climbing is still only located on the outside of the pin, the wettable area is still limited, and its bonding ability is still not ideal.

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