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Integrated high-brightness LED light-emitting unit and making method thereof

A light-emitting unit and a technology of a manufacturing method, which are applied to electrical components, electric solid-state devices, circuits, etc., can solve the problems of small LED light-emitting angle, elevation, and large volume, and achieve the effect of constant current

Inactive Publication Date: 2017-06-20
张伯文
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The luminous efficiency of LED lamps mainly depends on its light-emitting unit, especially high-power LED lamps use LED lamp beads, and use SMT technology to fix the LED lamp beads on the aluminum substrate and ceramic board with circuit by using solder paste, and then pass the circuit and The driving power supply is connected, and the alternating current is converted into direct current by the driving power supply to light up the LED lamp bead, and then made into an LED light bulb. , the solder joints are easy to fall off, especially the electrodes are easy to loose and cause quality problems
In addition, when the LED emits light, the LED chip will generate a large amount of heat. At present, the heat generated by the LED is mainly dissipated through heat conduction, but this heat cannot be completely eliminated in a timely and effective manner. The heat generated by the LED chip continues to accumulate, and the performance of the LED chip decreases. As the temperature rises, the light output weakens. After the temperature rises, the internal resistance of the LED increases, the heat generated further increases, and the light output is further weakened, resulting in a vicious circle

Method used

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  • Integrated high-brightness LED light-emitting unit and making method thereof
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  • Integrated high-brightness LED light-emitting unit and making method thereof

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Embodiment Construction

[0024] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0025] In describing the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", The orientations or positional relationships indicated by "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the It should not be construed as limiting the invention ...

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Abstract

The invention provides an integrated high-brightness LED light-emitting unit comprising a substrate, an LED chip, a rectifier circuit, and a fluorescent coating. The rectifier circuit includes rectifier diode naked crystals and silver layer lines arranged on the substrate. The LED chip, the substrate and the rectifier circuit are packaged in the fluorescent coating as a whole. The rectifier circuit needed by an LED lamp is packaged in the form of naked crystals together with the LED chip and the substrate, and the problem that an LED lamp has a large size because of an external rectifier circuit is solved. A current stabilizer tube is added and packaged together with other components, so that the current in the circuit is relatively constant, and an LED lamp can emit light stably. Electrodes are fixed by high-temperature glue, and will not be loosened in the sealing process of an LED lamp.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to an integrated high-brightness LED light-emitting unit and a manufacturing method thereof. Background technique [0002] The luminous efficiency of LED lamps mainly depends on its light-emitting unit, especially high-power LED lamps use LED lamp beads, and use SMT technology to fix the LED lamp beads on the aluminum substrate and ceramic board with circuit by using solder paste, and then pass the circuit and The driving power supply is connected, and the alternating current is converted into direct current by the driving power supply to light up the LED lamp bead, and then made into an LED light bulb. , the solder joints are easy to fall off, especially the electrodes are easy to loose and cause quality problems. In addition, when the LED emits light, the LED chip will generate a large amount of heat. At present, the heat generated by the LED is mainly dissipated through heat conduc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16
CPCH01L25/167
Inventor 张伯文
Owner 张伯文
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