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Acoustic wave type fingerprint identification device and electronic device using the same

A fingerprint recognition and sound wave technology, which is used in character and pattern recognition, acquisition/organization of fingerprints/palmprints, and print image acquisition. , the identification results are accurate, the effect of simplifying the structure

Active Publication Date: 2020-12-15
RECO TECH CHENGDU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the signal of the sound wave will attenuate after passing through each medium layer, and the difference in the flatness and density of the medium layer will lead to uneven transmission of the sound wave, which will eventually lead to uneven signal imaging and a decrease in resolution.

Method used

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  • Acoustic wave type fingerprint identification device and electronic device using the same
  • Acoustic wave type fingerprint identification device and electronic device using the same
  • Acoustic wave type fingerprint identification device and electronic device using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Such as figure 1 As shown, the acoustic wave fingerprint identification device 100 according to the first embodiment of the present invention includes a cover plate 111 , a circuit substrate 130 , an ultrasonic sensing unit 150 , and a signal transmission unit 170 .

[0023] The circuit substrate 130 is fixed on one side of the cover plate 111, the ultrasonic sensing unit 150 and the signal transmission unit 170 are placed on the side of the circuit substrate 130 away from the cover plate 111, and one end of the signal transmission unit 170 is connected to a control device (not shown in the figure) , and the other end is simultaneously connected to the ultrasonic sensing unit 150 and the circuit substrate 130 to realize signal transmission.

[0024] The cover plate 111 is bonded to the circuit substrate 130 through the first adhesive layer 113 .

[0025] The circuit substrate 130 includes a first surface 131 and a second surface 133 opposite to the first surface 131 , ...

Embodiment 2

[0034] Such as figure 2 As shown, the acoustic wave fingerprint identification device 200 according to the second embodiment of the present invention includes a cover plate 211 , a circuit substrate 230 , an ultrasonic sensing unit 250 , and a signal transmission unit 270 .

[0035] The circuit substrate 230 is fixed on one side of the cover plate 211, the ultrasonic sensing unit 250 and the signal transmission unit 270 are placed on the side of the circuit substrate 230 away from the cover plate 211, and one end of the signal transmission unit 270 is connected to a control device (not shown in the figure) , and the other end is simultaneously connected to the ultrasonic sensing unit 250 and the circuit substrate 230 to realize signal transmission.

[0036] The cover plate 211 covers one side of the first adhesive layer 213 , and the other side of the first adhesive layer 213 away from the cover plate 211 is in contact with the circuit substrate 230 .

[0037]The circuit sub...

Embodiment 3

[0046] Such as image 3 As shown, the acoustic wave fingerprint identification device 30 according to the third embodiment of the present invention includes a cover plate 311 , a circuit substrate 330 , an ultrasonic sensing unit 350 , and a signal transmission unit 370 .

[0047] The circuit substrate 330 is fixed on one side of the cover plate 311, the ultrasonic sensing unit 350 and the signal transmission unit 370 are placed on the side of the circuit substrate 330 away from the cover plate 311, and one end of the signal transmission unit 370 is connected to a control device (not shown in the figure) , and the other end is simultaneously connected to the ultrasonic sensing unit 350 and the circuit substrate 330 to realize signal transmission.

[0048] The cover plate 311 covers one side of the first adhesive layer 313 , and the other side of the first adhesive layer 313 away from the cover plate 311 is in contact with the circuit substrate 330 .

[0049] The circuit subst...

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Abstract

An acoustic wave fingerprint identification device, comprising a circuit substrate, an ultrasonic sensing unit and a signal transmission unit formed on the surface of the circuit substrate, the circuit substrate contains a circuit, and the ultrasonic sensing unit is sequentially stacked on the circuit substrate away from A first electrode, a piezoelectric polymer layer, and a second electrode on one side of the cover plate, the signal transmission unit electrically connects the circuit and the second electrode to realize signal transmission, and the material forming the second electrode is The pore size of the pores is less than 10um. The invention also provides an electronic device using the acoustic wave fingerprint identification device.

Description

technical field [0001] The invention relates to an acoustic wave fingerprint identification device and an electronic device using the acoustic wave fingerprint identification device. Background technique [0002] With the widespread use of portable electronic devices, users have put forward more functional requirements for portable electronic devices. Due to the privacy protection function, the fingerprint identification device is installed in the portable electronic device to enhance user experience. Fingerprint identification devices can be divided into optical, capacitive, and acoustic wave types. Acoustic fingerprint identification devices are widely used because their operations are not easily affected by ambient temperature and humidity, and they have a long life and high resolution. [0003] A conventional ultrasonic fingerprint recognition element is capable of recognizing the fingerprint of a finger placed on the fingerprint recognition element. When the user put...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K9/00
CPCG06V40/1306
Inventor 郑小兵
Owner RECO TECH CHENGDU CO LTD