A semiconductor processing equipment

Abstract

The present invention provides a semiconductor processing equipment, including a process chamber and a transfer chamber, the transfer chamber includes a first chamber and a second chamber connected to the process chamber, the first chamber and the second chamber The chambers are respectively equipped with manipulators, the first chamber is used to load substrates into the process chamber through the manipulators in the first chamber; the second chamber is used to unload the substrates in the process chamber through the manipulators in the chambers ; The second chamber has a suction device for pumping the second chamber to discharge the residual product located on the surface of the substrate. The semiconductor processing equipment provided by the invention can largely avoid pollution and corrosion to the transmission platform and the cassette loading device, thereby improving the service life of the semiconductor processing equipment and reducing the maintenance cycle.

Description

technical field [0001] The invention belongs to the technical field of semiconductor equipment processing, and relates to semiconductor processing equipment. Background technique [0002] The dry etching process is one of the most influential and crucial processes in the manufacturing process of integrated circuits. This process generally uses plasma generated by gases or compounds containing halogen elements (fluorine, chlorine, bromine) under the action of radio frequency voltage. , the plasma etches the surface of the substrate to form a desired pattern. [0003] figure 1 It is a schematic diagram of the structure of the existing etching equipment. see figure 1 , the etching equipment includes a process chamber (Process Module, referred to as PM), a transfer platform and a cassette loading device (Load Port, referred to as LP), and the transfer platform includes a vacuum transfer chamber (Vacuum Transport Module, referred to as VTM), a loading port Lock chamber Loadlo...

AI Technical Summary

Problems solved by technology

In practical applications, it is found that the substrate will produce volatile etching products during the etching process in the process chamber PM, and the volatile etching products will partially remain on the surface of the substrate, and of course it will The transmission of the film is brought into various parts of the transmission platform (such as VTM, LA / LB, ATM) and the cassette loading device LP. Due to the unstable nature of the etching product, it will sometimes evaporate and disappear naturally over time. , which will cause corrosion and pollution to various parts of the transmission platform and the parts of the cassette loading device LP, resulting in low service life and short maintenance cycle of the equipment

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