Method for protecting fine pattern and depositing metal layer using back exposure technology

Abstract

The present invention relates to a method for protecting a micropattern and depositing a metal layer using backside illumination technology, which allows a photoresist metal layer to be deposited on a transparent substrate and a metal layer in a state where a predetermined pattern is formed thereon while protecting a pattern that has already been formed, without alignment error and without using an optical device mask for an additional process, and which also allows post processing to be performed so as to match an existing pattern hole when performing additional etching for the pattern that has already been processed on the transparent substrate, thereby enabling precise post processing. The present invention as described above is characterized by comprising: an etching step of etching a metal layer and a transparent substrate using a photoresist comprising a predetermined pattern with respect to the metal layer formed on the transparent substrate to thereby form a pattern hole on the metal layer and the transparent substrate, or forming a pattern hole on the metal layer by etching the metal layer; a backside illumination preparation step of applying a photosensitive material onto the metal layer and the pattern hole with the predetermined pattern being formed therein by etching; and a backside illumination step of eliminating a part of the photosensitive material by backside illumination at the transparent substrate side, wherein the photosensitive material is formed of a positive photoresist, and the photosensitive material is eliminated from the predetermined pattern hole through the backside illumination step. The backside illumination step is followed by an additional etching step of etching the transparent substrate in the predetermined pattern hole from which the photosensitive material has been eliminated.

Description

technical field [0001] The present invention relates to a method of protecting a fine pattern and depositing a metal layer using back exposure technology, which does not use an optical element mask for an additional process in a state where a predetermined pattern is formed on a transparent substrate and a metal layer, and there is no alignment Deposition of photoresist and metal layer while protecting the already formed pattern from errors, and when additional etching is performed on the pattern processed on the transparent substrate, post-processing can be performed in conformity with the existing pattern hole, thereby enabling Realize precise post-processing. Background technique [0002] Generally, transparent substrates are commonly used for optical elements, display panels, and the like. By laminating and coating metal layers or resin layers on such a transparent substrate, a predetermined pattern is formed to utilize the characteristics of the device. [0003] A plu...

AI Technical Summary

Problems solved by technology

[0007] However, if figure 1 In the example in , the pattern formation of the post-process is to use the exposure in the upper direction, so it is difficult for the pattern formed by the post-process to be consistent with the original pattern

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