Method for removing dielectric layer on surface of metal layer at top of semiconductor device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SEMICON MFG INT (SHANGHAI) CORP
- Publication Date
- 2009-01-07
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for removing a dielectric layer on the surface of a metal layer on the top of a semiconductor optical device. Background technique
[0002] In the current manufacturing process of semiconductor optical devices, a dielectric layer is usually formed on the surface of the top metal layer, and then the electrical performance test of the semiconductor optical device substrate containing the top metal layer is performed, and then the dielectric layer is removed to obtain a smooth and flat top. surface of the metal layer, and then proceed to subsequent production steps.
[0003] figure 1 It is a schematic diagram of the deposition effect of the dielectric layer on the surface of the metal layer on the top of the semiconductor optical device in the prior art, such as figure 1 As shown, a dielectric layer 10 is deposited on the surface of the top metal layer...