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Borophosphosilicate glass, commonly known as BPSG, is a type of silicate glass that includes additives of both boron and phosphorus. Silicate glasses such as PSG and borophosphosilicate glass are commonly used in semiconductor device fabrication for intermetal layers, i.e., insulating layers deposited between succeedingly higher metal or conducting layers.
CARRIER AND METHOD FOR MANUFACTURING A VERTICAL POWER SEMICONDUCTOR DEVICE
Support (200) comprising: a support body (202); a bonding material (204) on a first main surface (208) of the support body (202), wherein the support (200) is configured to be attached to a semiconductor wafer via the bonding material (204) by wafer bonding, wherein the support body (202) contains one or more of silicon, boron phosphosilicate glass, borosilicate glass, phosphosilicate glass, boron nitride, polycrystalline silicon, silicon carbide; and dopants integrated in a first part (216) of the support (200) on the first main surface (208), wherein the dopants are configured to eject from the support (200) by thermal processing and are configured to form an n-type or p-type doping in the semiconductor wafer.
Owner:INFINEON TECH AUSTRIA AG