A heat dissipation device with through holes inside the heat sink

Abstract

The invention discloses a cooling device for through holes in cooling fins. The cooling device comprises a base plate and the cooling fins. The base plate and the cooling fins are connected in an inserted manner. T-shaped grooves are formed in the upper surface of the base plate. Through openings are formed in groove bottoms of the T-shaped grooves. A fixing plate capable of sliding is arranged on the side face, provided with the grooves, of the base plate. The shape of one end of each cooling fin is matched with the shape of the corresponding T-shaped groove, and a through opening is formed in one end of each cooling fin. Silicon grease thin films are arranged on groove faces of the T-shaped grooves. The base plate is internally provided with a fog outlet plate, the inner portion of the base plate is divided into a water storage layer and a fog layer, and the water storage layer is located below the fog layer. An opening face is arranged on the side face of the water storage layer. A water inlet is formed in the upper portion of the opening face, a water outlet is formed in the lower portion of the opening face, and the water inlet and the water outlet are each closed through a piston. At least one stirring device is arranged in the water storage layer and is connected with the bottom of the base plate. At least 1000 fog holes are formed in the fog outlet plate. A liquid level sensor and a water storage container are further included. The water storage container is connected with the outer side of the base plate and is located above the water inlet, and the liquid level sensor is located in the base plate.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device with through holes inside a heat dissipation fin. Background technique [0002] The heat dissipation method refers to the main way the radiator dissipates heat. In thermodynamics, heat dissipation is heat transfer, and there are three main ways of heat transfer: heat conduction, heat convection and heat radiation. The transfer of energy by itself or when matter comes into contact with matter is known as heat conduction, and it is the most common form of heat transfer. Convection refers to the transfer of heat by a moving fluid that carries heat away. Thermal radiation refers to the transfer of heat by ray radiation, the most common of which is solar radiation. These three heat dissipation methods are not isolated. In daily heat transfer, these three heat dissipation methods all occur at the same time and work together. In fact, any type of radiator basica...

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is the welding structure of the substrate and the heat sink, the heat sink is difficult to clean, and the heat sink cannot be replaced independently according to the change of the environment, and the bottom of the substrate is heated unevenly, resulting in uneven heat transfer to the heat sink , the overall heat dissipation can only rely on the contact between the heat sink and the air. The purpose is to provide a heat dissipation device with through holes inside the heat sink to solve the welding structure of the substrate and the heat sink. The heat sink is difficult to clean and cannot be separated according to the change of the environment. Replace the heat sink, and the bottom of the substrate is heated unevenly, resulting in uneven heat transfer to the heat sink, and the overall heat dissipation can only rely on the contact between the heat sink and the air

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