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Loudspeaker device with circuit board integrated asic

A loudspeaker and circuit board technology, which is applied in the direction of electrostatic transducer speakers, electrostatic transducer microphones, microphones, etc., and can solve problems such as high installation volume

Active Publication Date: 2020-03-13
USOUND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Known MEMS loudspeakers have the disadvantage that they have a relatively high installation volume

Method used

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  • Loudspeaker device with circuit board integrated asic
  • Loudspeaker device with circuit board integrated asic
  • Loudspeaker device with circuit board integrated asic

Examples

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Embodiment Construction

[0037] In the following description of the drawings, in order to define the relationship between the respective elements, for example, above, below, above, below, above, below, Relative terms like left, right, vertical, and horizontal. It is self-evident that these terms may vary from where devices and / or elements are positioned differently than shown in the figures. Thus, for example, when referring to the reverse orientation of devices and / or elements as shown in the figures, features which were stated to be above in the following description of the figures would now be arranged below. The relative terms used are thus used only to briefly describe the relative relationship between the various devices and / or elements described below. In the embodiment shown in said figures, the z-axis of the MEMS speaker - the direction of which the membrane of the MEMS speaker can vibrate - is vertical or between the lower and upper sides of the speaker device extend.

[0038] figure 1 A...

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PUM

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Abstract

The invention relates to a loudspeaker device (1) comprising: a circuit board (2); a MEMS loudspeaker (3) for generating sound waves in the audible wavelength spectrum, said MEMS loudspeaker (3) having a A deflected diaphragm (9); an acoustic channel (21) adjacent to the MEMS speaker (3), the acoustic channel (21) having an acoustic outlet (22); and an ASIC (4) connected to the MEMS speaker (3 ) electrical connection. Furthermore, the circuit board (2) has a first circuit board cavity (11) in which the ASIC (4) is arranged such that the ASIC (4) is fully integrated in the circuit board (2) middle. In addition, the circuit board (2) has a second circuit board cavity (13) with an opening (14) which is enclosed by means of a MEMS speaker (3) such that the second circuit board cavity (13 ) form at least part of the cavity (15) of the MEMS speaker (3). According to the invention, the acoustic channel (21) extends obliquely to the z-axis of the MEMS loudspeaker. Furthermore, the sound outlet (22) is arranged at the side of the loudspeaker device (1).

Description

technical field [0001] The present invention relates to a speaker device having: a circuit board; a MEMS speaker for generating sound waves in the audible wavelength spectrum; and an ASIC electrically connected to the MEMS speaker. Background technique [0002] The term MEMS stands for microelectromechanical system. [0003] MEMS loudspeakers or microspeakers are known, for example, from DE 10 2012 220 819 A1. The sound generation takes place via the vibratingly mounted membrane of the MEMS loudspeaker. Such microspeakers generally have to generate high air volume displacements in order to achieve significant sound pressure levels. Known MEMS loudspeakers have the disadvantage that they have a relatively high installation volume. Contents of the invention [0004] The object of the present invention is to provide a loudspeaker arrangement which is designed to be very compact. [0005] This task is solved by a loudspeaker arrangement having the features of the embodimen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04
CPCH04R19/04H04R2201/003H04R19/02H04R3/00
Inventor 安德里亚·韦斯高尼·克莱里西·贝尔特拉米费鲁乔·博托尼
Owner USOUND