Integrated circuit follow-up alignment pressure measuring device and follow-up alignment method

Abstract

The invention relates to the field of integrated circuit testing and aims to provide a pressure testing device based on follow-up alignment for an integrated circuit and a follow-up alignment method. The pressure testing device based on follow-up alignment for the integrated circuit comprises at least one film cylinder provided with a cylinder head at the upper end, an adapter plate connected with the upper ends of the cylinder heads as well as follow-up mechanisms in equal quantity with the film cylinders and in one-to-one correspondence with the film cylinders, wherein each follow-up mechanism comprises a connecting plate connected with the lower end of the corresponding film cylinder, a horizontal follow-up unit connected with the lower end of the connecting plate and a high-temperature-resistant pressure testing assembly which is provided with a heater and connected with the lower end of the horizontal follow-up unit. The pressure testing device based on follow-up alignment for the integrated circuit is convenient to align with an integrated circuit seat and higher in testing efficiency; the integrated circuit bears pressure in a balanced manner during testing, and the testing precision is improved; the film cylinders have an extrusion cushioning effect when the pressure testing device based on follow-up alignment for the integrated circuit and an integrated circuit pressure testing seat are enabled to be in position.

Description

Technical field [0001] The invention relates to the field of integrated circuit testing, in particular to an integrated circuit follow-up alignment pressure measurement device and a follow-up alignment method. Background technique [0002] The integrated circuit needs to be pressure tested to ensure sufficient strength and rigidity; the traditional integrated circuit pressure test has difficulty in positioning the pressure measuring device and the integrated circuit socket. The test efficiency is low, and the test accuracy is reduced due to the uneven pressure of the integrated circuit during the test Therefore, it is necessary to design a follow-up pressure test device and follow-up pair for an integrated circuit pressure test device that is aligned with the IC holder to facilitate higher test efficiency, and the IC pressure is balanced during testing to improve the test accuracy. Position method has become an urgent problem to be solved. Summary of the invention [0003] The pu...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the shortcomings of the current integrated circuit pressure test that the pressure measuring device and the integrated circuit seat are difficult to align, the test efficiency is low, and the test accuracy is reduced due to the unbalanced pressure on the integrated circuit during the test, and a pressure measurement method is provided. The alignment between the device and the integrated circuit seat is convenient, the test efficiency is high, and the integrated circuit pressure is balanced during the test to improve the test accuracy. Integrated circuit follow-up alignment pressure measuring device and follow-up alignment method

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