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A display panel, a display device, and a method for manufacturing a display panel

A display panel and manufacturing method technology, applied in the direction of instruments, semiconductor devices, circuits, etc., to achieve the effect of reducing quantity, high resolution, and realizing narrow frame design

Active Publication Date: 2022-06-17
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of this, an embodiment of the present invention provides a display panel, a display device, and a method for manufacturing a display panel to solve the existing problems in the prior art of how to obtain a display panel with a narrow border while ensuring high resolution. question

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  • A display panel, a display device, and a method for manufacturing a display panel
  • A display panel, a display device, and a method for manufacturing a display panel
  • A display panel, a display device, and a method for manufacturing a display panel

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Embodiment Construction

[0050] The specific implementations of the display panel, the display device and the manufacturing method of the display panel provided by the embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0051] The shapes and sizes of the film layers in the drawings do not reflect their actual proportions in the display panel, and are only intended to illustrate the content of the present invention.

[0052] A display panel provided by an embodiment of the present invention, such as Figures 2a to 2h As shown, it includes: a display substrate 201 , a chip on film 202 disposed on the side of the display surface away from the display substrate 201 , an insulating adhesive 203 disposed between the display substrate 201 and the chip on film 202 , and a chip 202 fixed on the chip on film 202 The integrated circuit chip 204 on the side away from the display substrate 201; wherein,

[0053] The chip on film 202 is fixed on the...

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Abstract

The invention discloses a display panel, a display device and a manufacturing method of the display panel, comprising: a display substrate, a chip-on-chip film fixed on the side of the display substrate away from the display surface through insulating glue, and a chip-on-film film fixed on a side away from the display substrate. An integrated circuit chip on the side; wherein, at the first side and the second side of the display surface, there are respectively a plurality of connection holes through at least the display substrate and the insulating glue, and a conductive material filled in each connection hole; located at the first The signal lines at the first side and the signal lines at the second side are respectively connected to connection terminals provided on the chip-on-film through conductive materials. A large number of signal lines required by a high-resolution display panel are arranged on the first side and the second side respectively, and the signal lines are respectively passed through the connection holes in the first side and the second side. The conductive material is connected to the connection terminal, thereby reducing the number of connection holes on one side, and realizing the narrow frame design of the high-resolution display panel.

Description

technical field [0001] The present invention relates to the field of display technology, and in particular, to a display panel, a display device and a manufacturing method of the display panel. Background technique [0002] With the continuous advancement of display technology, display panels are more and more widely used in display products. Display panels with narrow bezels attract a large number of consumers because they can enable users to obtain a better viewing experience. [0003] At present, the Pad Bending process is the only solution to realize a display panel with a narrow bezel. However, the display panel manufactured by the connecting terminal bending process has many problems. For example, as Figure 1a As shown, cracks occur in the inorganic insulating layer in the bending region P of the connection terminal, which may lead to display failure. In the prior art, a mask process is added to remove the inorganic insulating layer in the bending region P of the c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1345H01L23/50
CPCH01L23/50G02F1/13452G06F1/1637G06F1/1652H01L25/0753H01L33/0095H01L33/62H01L2933/0066
Inventor 董向丹高永益胡明
Owner BOE TECH GRP CO LTD