Resin sealing mold and method for manufacturing resin forming section of electronic component

A resin sealing and mold technology, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as voids in resin molding parts
CN107081879AActive Publication Date: 2017-08-22DAIICHI SEIKO CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
DAIICHI SEIKO CO LTD
Publication Date
2017-08-22

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Abstract

The invention provides a resin sealing mold, the mold can effective exhaust air to outside from the molten resin-injected cavity, and a deburring machine is well used to remove the burr of an intermediate product. In the resin sealing mold, the cavity (60) is formed through the lower side cavity (25) arranged in a lower side cavity block and the upper side cavity (35) arranged in an upper side cavity block (33). A dam block (27) is arranged on the upper surface (23a) of the lower side cavity block along the opening edge of the lower side cavity (35), the dam block (27) is configurated in an un-abutted way with the upper surface of a lead frame when the lead frame is clamped, an exhaust port (36) is arranged on the lower surface (33a) of the upper side cavity block (33), is separated with the upper side cavity (35) and is communicated with the outside. The height of the dam block (27) is less than the thickness of the lead frame (40). When the lead frame is clamped, the exhaust port (36) and the dam block (27) are partly overlapped.
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Description

technical field

[0001] The present invention relates to a resin sealing mold and a method of manufacturing a resin molded portion of an electronic component using the resin sealing mold. Background technique

[0002] Generally, there is known a resin sealing device that uses multi-station molding to resin-encapsulate electronic components mounted on a lead frame (for example, discrete semiconductor elements with a single function) to manufacture resin molded parts of electronic components. When using a resin sealing device to manufacture a resin molded part of an electronic component, first, the lead frame is clamped by the upper mold and the lower mold that constitute the resin sealing mold. Next, the inner cavity formed between the upper mold and the lower mold is filled with the molten resin, and then pressurized and solidified, thereby manufacturing an electronic component positioned in the inner cavity in the lead frame. Intermediate products of the resin molding depar...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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