High precision integrated type thermosensitive circuit capable of being responded quickly and manufacturing method thereof

A manufacturing method and high-precision technology, applied in the field of sensors, can solve the problems of long path, affecting the speed and accuracy of temperature measurement, and achieve the effect of small temperature measurement error and small intermediate heat loss

Active Publication Date: 2017-08-22
SHENZHEN REFRESH INTELLIGENT TECH CO LTD
View PDF11 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that the temperature transmission path is relatively long, and the temperature of the thermal chip will be stable only after the temperature of the secondary packaging glue and the primary packaging glue are st

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High precision integrated type thermosensitive circuit capable of being responded quickly and manufacturing method thereof
  • High precision integrated type thermosensitive circuit capable of being responded quickly and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] A high-precision integrated thermal circuit that can respond quickly, including a thermistor unit 2, and a ceramic base layer 1 with more than two layers, the number of thermistor units 2 is more than 2, and the thermistor unit 2 is linear distributed in layers, at least 2 thermistor units 2 are located in different layers;

[0034] Wherein, the "layer" in the different layers refers to the upper part, the lower part of the ceramic base layer 1 or embedded in the ceramic base layer 1 .

[0035] The thermistor unit 2 adopts a linear structure, which has small heat storage, fast temperature rise, timely response, and little influence on the ambient temperature. The ceramic base is used as the base material, so that the temperature transmission path is relatively short and the intermediate heat loss is relatively small. , so that the temperature measurement error is relatively small; when the thickness and material of the ceramic base layer are determined, according to t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Grain sizeaaaaaaaaaa
Grain sizeaaaaaaaaaa
Diameteraaaaaaaaaa
Login to view more

Abstract

The invention relates to a high precision integrated type thermosensitive circuit capable of being responded quickly. The high precision integrated type thermosensitive circuit comprises thermistor units and two layers of ceramic base layers or above, two thermistor units or more are arranged, the thermistor units are distributed in the layers in a linear mode, at least two thermistor units are located at different layers, and the layers refer to the upper portion and the lower portion of the ceramic base layers, or are embedded into the ceramic base layers. According to the thermistor units, linear structures are adopted, ceramic matrixes are used as base layers, so that the path of temperature transmission is relatively short, the heat transmission is quick, and the intermediate heat loss is relatively small, and the temperature measurement error is relatively small; when the thickness and the material of the ceramic base layers are determined, according to a thermal conduction formula, in a set time difference, a determined relation exists between the inter-layer temperature difference and the surface temperature, through the two thermistor units at different layers, the inter-layer temperature difference can be known, therefore the surface temperature can be quickly judged, and the temperature at the part in contact with the surface of a sensor can be further determined. The invention further provides a manufacturing method of the thermosensitive circuit.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a high-precision integrated thermal circuit that can respond quickly and a manufacturing method thereof. Background technique [0002] Temperature sensors are widely used in every aspect of our lives. [0003] In the prior art, traditional temperature sensors (such as electronic thermometers) are commonly used. Traditional temperature sensors are generally packaged with discrete thermal chips twice, with slow response speed and low accuracy. It takes about 30 seconds to 10 minutes for the sensitive chip to obtain a stable and relatively accurate temperature. For example, a medical electronic thermometer needs to be clamped under the armpit for at least 3 minutes to read the data. [0004] These problems are determined by the system structure and process of the prior art, and the specific description is as follows: The traditional temperature sensor includes a primary packaging s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G01K7/22H01C7/00H01C17/00H01C17/28H01C17/30
CPCH01C7/001H01C7/008H01C17/00H01C17/28H01C17/30G01K7/22
Inventor 李冠华颜丹
Owner SHENZHEN REFRESH INTELLIGENT TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap