5results about How to "Small error in temperature measurement" patented technology

This invention discloses a downconversion fluorescence thermometry method based on bilinear mode, implemented using a hardware system. The hardware system includes a 280nm light-emitting diode, two convex lenses, and a Tb... 3+ :Cs2Na 0.9 Ag 0.1 The system comprises InCl6 temperature-sensing material, a grating spectrometer, an oscilloscope, a signal generator, a computer, and a thermostat. The specific implementation steps are: signal excitation and acquisition; temperature calibration; actual temperature measurement; and high measurement accuracy: VPR mode linear correlation coefficient R² ≥ 0.998, FL mode linear correlation coefficient R² ≥ 0.992, avoiding measurement errors introduced by the exponential bias or correction term of traditional FIR technology, thus fundamentally improving temperature measurement accuracy.

This invention discloses an infrared temperature measurement correction method, apparatus, and system for three-dimensional curved surfaces. The infrared temperature measurement correction method includes: dividing the blade surface into at least two emissivity measurement regions according to the surface type of the blade being measured; acquiring the emissivity distribution of each emissivity measurement region on the blade surface at different temperatures; obtaining bidirectional reflection distribution functions for different surface types based on the projected energy of the infrared light source at different incident angles and the reflected energy received by the infrared camera at different detection angles; and obtaining the corrected measurement temperature based on the acquired emissivity distribution of each emissivity measurement region on the blade surface at different temperatures and the bidirectional reflection distribution functions for different surface types. This invention has a wide range of applications and high correction accuracy, and can be used to correct infrared temperature measurements of curved surfaces such as aero-engine turbine blades in complex environments, enabling non-contact, multi-dimensional, and online measurement of curved surfaces.

A lead-free packaged all-quartz resonant pressure sensor comprises a 3J21 alloy shell cover, the 3J21 alloy shell cover is connected with a 3J21 alloy shell in a sealed mode, and a quartz island film pressure conversion unit, a quartz resonant layer element and a quartz base component which are connected through a vacuum glass frit sealing technology are arranged in an inner cavity formed by the 3J21 alloy shell cover and the 3J21 alloy shell. Glass frit dielectric layers are arranged between the quartz island film pressure conversion unit and the quartz resonance layer element as well as between the quartz resonance layer element and the quartz base part; three quartz layers and two glass frit dielectric layers are connected to form an all-quartz pressure chip; the all-quartz pressure chip, the 3J21 alloy shell and the gold-plated lead column are connected through sintering of glass silver paste, and a chip electrode signal is led out through the gold-plated lead column; according to the invention, the long-term stability of the sensor is significantly improved, the mechanical strength and reliability of electrical connection are enhanced, real-time and homologous sensing of temperature signals is realized, and the compensation precision of the sensor in a full temperature range is effectively improved.

The application provides a dry burning prevention temperature measuring probe, a pot bottom temperature measuring method and a burner, and belongs to the technical field of burners. The dry burning prevention temperature measuring probe comprises an inner ring assembly and an outer ring assembly. The inner ring assembly comprises an inner ring moving piece and an inner ring temperature measuring piece. The inner ring temperature measuring piece is in heat conduction contact with the inner ring moving piece. The outer ring assembly comprises a plurality of outer ring moving pieces and a plurality of outer ring temperature measuring pieces. A single outer ring moving piece is in heat conduction contact with a plurality of outer ring temperature measuring pieces. The inner ring moving piece and the plurality of outer ring moving pieces are arranged at intervals along the radial direction of the dry burning prevention temperature measuring probe from the inside to the outside. Through the above structure, the dry burning prevention temperature measuring probe can be closely combined with the bottom of the pot, multi-point temperature measurement is realized, the accuracy of temperature measurement of the dry burning prevention temperature measuring probe is improved, and misjudgment is avoided. When the temperature of the bottom of the pot reaches the threshold value of the temperature measuring piece, the gas supply is cut off to prevent the pot from being dry.

This utility model relates to the field of temperature acquisition technology, specifically to a dynamic temperature acquisition device for pharmaceutical cold chain with a multi-level buffer structure. It includes a housing, with a protruding plate fixedly connected to the outer side of the housing. One end of the housing has symmetrically arranged threaded grooves, and one side of the housing has symmetrically arranged mounting components. The mounting components include a connecting plate, with a sliding plate slidably connected to a sliding groove inside the connecting plate. A rotating rod is rotatably connected to an ear plate on one side of the connecting plate. Rotating the rotating rod drives a threaded rod at one end of the rotating rod to move axially along the threaded groove, adjusting the distance between the sliding plate and the protruding plate. This clamps and fixes the device in the installation position, adapting to cold chain box sidewalls of different thicknesses, achieving "one-click" quick installation without drilling or gluing, avoiding damage to the box, ensuring device stability, and improving installation efficiency.